JPS6469023A - Inspection device for surface of wafer - Google Patents

Inspection device for surface of wafer

Info

Publication number
JPS6469023A
JPS6469023A JP22700587A JP22700587A JPS6469023A JP S6469023 A JPS6469023 A JP S6469023A JP 22700587 A JP22700587 A JP 22700587A JP 22700587 A JP22700587 A JP 22700587A JP S6469023 A JPS6469023 A JP S6469023A
Authority
JP
Japan
Prior art keywords
light
wafer
reflected light
oblique projection
receptor
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP22700587A
Other languages
Japanese (ja)
Inventor
Shinichi Wakana
Mikio Suetake
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fujitsu Ltd
Original Assignee
Fujitsu Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fujitsu Ltd filed Critical Fujitsu Ltd
Priority to JP22700587A priority Critical patent/JPS6469023A/en
Publication of JPS6469023A publication Critical patent/JPS6469023A/en
Pending legal-status Critical Current

Links

Landscapes

  • Investigating Materials By The Use Of Optical Means Adapted For Particular Applications (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)

Abstract

PURPOSE:To increase the speed of feedback by composing the title inspection device of a long-sized light source for oblique projection light tying line focuses in the direction rectangular to the direction of carrying of a wafer surface, a projection lens, a long-sized receiving lens receiving only irregular reflected light, a receptor, and a douser mutually making oblique projection light, irregular reflected light and reflected light independent. CONSTITUTION:Linear oblique projection light L emitted from a light source 10 is focussed on the surface of a wafer 1 placed onto a carrier 6 jagging in the direction (a) as line beams by a projection lens 11. When there is no dust and foreign matter on the surface of the wafer 1, oblique projection light L total-reflects on the surface of the wafer 1 and is changed into reflected light L', and the light is recognized as normal reflected light. When contaminated particles adhere on the surface of the wafer 1, oblique projection light L is turned into scattered light and one part thereof is converted into irregular reflected light L'' and condensed to a receptor 13 through a receiving lens 12, and an electric signal is generated from the receptor 13. The electric signal is fed back to a preprocess as an alarm, and the wafer is treated as an abnormal one while a countermeasure treatment is executed in the preprocess, and subsequent wafers are changed into nondefectives. Accordingly, the status of the adhesion of contaminated particles on all wafers is monitored, thus improving the yield of the wafers.
JP22700587A 1987-09-10 1987-09-10 Inspection device for surface of wafer Pending JPS6469023A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP22700587A JPS6469023A (en) 1987-09-10 1987-09-10 Inspection device for surface of wafer

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP22700587A JPS6469023A (en) 1987-09-10 1987-09-10 Inspection device for surface of wafer

Publications (1)

Publication Number Publication Date
JPS6469023A true JPS6469023A (en) 1989-03-15

Family

ID=16854017

Family Applications (1)

Application Number Title Priority Date Filing Date
JP22700587A Pending JPS6469023A (en) 1987-09-10 1987-09-10 Inspection device for surface of wafer

Country Status (1)

Country Link
JP (1) JPS6469023A (en)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6894773B2 (en) 1991-04-02 2005-05-17 Renesas Technology Corp. Method and apparatus for analyzing the state of generation of foreign particles in semiconductor fabrication process
JP2013504768A (en) * 2009-09-14 2013-02-07 エルジー ケム. エルティーディ. Foreign object detection device in pouch-type battery
JP2015125003A (en) * 2013-12-25 2015-07-06 株式会社アイテックシステム Luminaire
US11390145B2 (en) 2019-03-06 2022-07-19 Dr. Ing. H. C. F. Porsche Ag Motor vehicle

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6894773B2 (en) 1991-04-02 2005-05-17 Renesas Technology Corp. Method and apparatus for analyzing the state of generation of foreign particles in semiconductor fabrication process
US7177020B2 (en) 1991-04-02 2007-02-13 Renesas Technology Corp. Method and apparatus for analyzing the state of generation of foreign particles in semiconductor fabrication process
JP2013504768A (en) * 2009-09-14 2013-02-07 エルジー ケム. エルティーディ. Foreign object detection device in pouch-type battery
JP2015125003A (en) * 2013-12-25 2015-07-06 株式会社アイテックシステム Luminaire
US11390145B2 (en) 2019-03-06 2022-07-19 Dr. Ing. H. C. F. Porsche Ag Motor vehicle

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