JPS6469023A - Inspection device for surface of wafer - Google Patents
Inspection device for surface of waferInfo
- Publication number
- JPS6469023A JPS6469023A JP22700587A JP22700587A JPS6469023A JP S6469023 A JPS6469023 A JP S6469023A JP 22700587 A JP22700587 A JP 22700587A JP 22700587 A JP22700587 A JP 22700587A JP S6469023 A JPS6469023 A JP S6469023A
- Authority
- JP
- Japan
- Prior art keywords
- light
- wafer
- reflected light
- oblique projection
- receptor
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Investigating Materials By The Use Of Optical Means Adapted For Particular Applications (AREA)
- Testing Or Measuring Of Semiconductors Or The Like (AREA)
Abstract
PURPOSE:To increase the speed of feedback by composing the title inspection device of a long-sized light source for oblique projection light tying line focuses in the direction rectangular to the direction of carrying of a wafer surface, a projection lens, a long-sized receiving lens receiving only irregular reflected light, a receptor, and a douser mutually making oblique projection light, irregular reflected light and reflected light independent. CONSTITUTION:Linear oblique projection light L emitted from a light source 10 is focussed on the surface of a wafer 1 placed onto a carrier 6 jagging in the direction (a) as line beams by a projection lens 11. When there is no dust and foreign matter on the surface of the wafer 1, oblique projection light L total-reflects on the surface of the wafer 1 and is changed into reflected light L', and the light is recognized as normal reflected light. When contaminated particles adhere on the surface of the wafer 1, oblique projection light L is turned into scattered light and one part thereof is converted into irregular reflected light L'' and condensed to a receptor 13 through a receiving lens 12, and an electric signal is generated from the receptor 13. The electric signal is fed back to a preprocess as an alarm, and the wafer is treated as an abnormal one while a countermeasure treatment is executed in the preprocess, and subsequent wafers are changed into nondefectives. Accordingly, the status of the adhesion of contaminated particles on all wafers is monitored, thus improving the yield of the wafers.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP22700587A JPS6469023A (en) | 1987-09-10 | 1987-09-10 | Inspection device for surface of wafer |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP22700587A JPS6469023A (en) | 1987-09-10 | 1987-09-10 | Inspection device for surface of wafer |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6469023A true JPS6469023A (en) | 1989-03-15 |
Family
ID=16854017
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP22700587A Pending JPS6469023A (en) | 1987-09-10 | 1987-09-10 | Inspection device for surface of wafer |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6469023A (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6894773B2 (en) | 1991-04-02 | 2005-05-17 | Renesas Technology Corp. | Method and apparatus for analyzing the state of generation of foreign particles in semiconductor fabrication process |
| JP2013504768A (en) * | 2009-09-14 | 2013-02-07 | エルジー ケム． エルティーディ． | Foreign object detection device in pouch-type battery |
| JP2015125003A (en) * | 2013-12-25 | 2015-07-06 | 株式会社アイテックシステム | Luminaire |
| US11390145B2 (en) | 2019-03-06 | 2022-07-19 | Dr. Ing. H. C. F. Porsche Ag | Motor vehicle |
-
1987
- 1987-09-10 JP JP22700587A patent/JPS6469023A/en active Pending
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6894773B2 (en) | 1991-04-02 | 2005-05-17 | Renesas Technology Corp. | Method and apparatus for analyzing the state of generation of foreign particles in semiconductor fabrication process |
| US7177020B2 (en) | 1991-04-02 | 2007-02-13 | Renesas Technology Corp. | Method and apparatus for analyzing the state of generation of foreign particles in semiconductor fabrication process |
| JP2013504768A (en) * | 2009-09-14 | 2013-02-07 | エルジー ケム． エルティーディ． | Foreign object detection device in pouch-type battery |
| JP2015125003A (en) * | 2013-12-25 | 2015-07-06 | 株式会社アイテックシステム | Luminaire |
| US11390145B2 (en) | 2019-03-06 | 2022-07-19 | Dr. Ing. H. C. F. Porsche Ag | Motor vehicle |
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