JPS646636Y2 - - Google Patents

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Publication number
JPS646636Y2
JPS646636Y2 JP1983071055U JP7105583U JPS646636Y2 JP S646636 Y2 JPS646636 Y2 JP S646636Y2 JP 1983071055 U JP1983071055 U JP 1983071055U JP 7105583 U JP7105583 U JP 7105583U JP S646636 Y2 JPS646636 Y2 JP S646636Y2
Authority
JP
Japan
Prior art keywords
acoustic
acoustic transducer
housing
bass
duct
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP1983071055U
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Japanese (ja)
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JPS59177287U (en
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Publication date
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Priority to JP7105583U priority Critical patent/JPS59177287U/en
Publication of JPS59177287U publication Critical patent/JPS59177287U/en
Application granted granted Critical
Publication of JPS646636Y2 publication Critical patent/JPS646636Y2/ja
Granted legal-status Critical Current

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  • Headphones And Earphones (AREA)
  • Audible-Bandwidth Dynamoelectric Transducers Other Than Pickups (AREA)

Description

【考案の詳細な説明】 産業上の利用分野 本考案は、低音域における周波数特性が改善さ
れたヘツドホンに関し、特に、小口径のインナー
イヤー型のヘツドホンに適用するのに好適なもの
である。
[Detailed Description of the Invention] Industrial Application Field The present invention relates to a headphone with improved frequency characteristics in the bass range, and is particularly suitable for application to a small-diameter inner-ear type headphone.

背景技術とその問題点 従来のオープンエア型ヘツドホンの低音域再生
限界は、主として振動系のコンプライアンスCnd
(ステイフネスSの逆数)と振動系の等価質量Md
とで決まり、第1図に示す如く、周波数が0以下
の低音域におけるレスポンスが低下していた。こ
0はほぼ01/2π√d nd(c/s)で与えられ
0 を低くするには振動系のコンプライアンスCnd
(cm/dyne)を高くするか、等価質量Md(gr)を
重くする必要がある。しかし、コンプライアンス
Cndを高くするには限度があり、また振動系の等
価質量Mdを重くすると、感度の低下や高音域に
おける音響特性の劣化等を招くので、等価質量
Mdを重くするにも自ら限界がある。
Background technology and its problems The low frequency reproduction limit of conventional open-air headphones is mainly due to the vibration system compliance C nd
(reciprocal of stiffness S) and equivalent mass of the vibration system M d
As shown in Figure 1, the response in the low frequency range below 0 was reduced. This 0 is approximately given by 0 1/2π√ d nd (c/s), and to lower 0 , the compliance of the vibration system C nd
(cm/dyne) or the equivalent mass M d (gr) needs to be increased. However, compliance
There is a limit to how high C nd can be made, and increasing the equivalent mass M d of the vibration system will lead to a decrease in sensitivity and deterioration of acoustic characteristics in the high frequency range.
There is a limit to how heavy M d can be made.

それに、周知の如く、この低音域共振周波数0
は小口径のヘツドホン程大きくなる傾向にあるか
ら、小口径のイヤホン等では、低音域の再生音が
聞きとりにくいという欠点があつた。
Moreover, as is well known, this low frequency resonance frequency is 0.
Since headphones tend to be louder with smaller diameters, earphones with smaller diameters have the disadvantage of making it difficult to hear reproduced sounds in the bass range.

例えば第2図に示す従来のイヤホンは、円筒状
のマグネツト1と、このマグネツト1を両面から
挾んだ円筒状のヨーク2及びプレート3とから磁
気回路を形成し、その磁気ギヤツプ4内に挿入さ
れるボイスコイル5に結合された振動板6を前面
に組込んで、音響変換器としてのドライバーユニ
ツト7を構成し、このドライバーユニツト7の外
周部を筐体8に取付けている。そして、ドライバ
ーユニツト7の中央の貫通孔9には吸音材10を
詰め、透孔11の背面には制動層12を設け、ま
た筐体8には幾つかの透孔13を設けて、周波数
特性をコントロールしている。
For example, in the conventional earphone shown in FIG. 2, a magnetic circuit is formed from a cylindrical magnet 1, a cylindrical yoke 2 and a plate 3 that sandwich the magnet 1 from both sides, and the earphone is inserted into a magnetic gap 4. A driver unit 7 as an acoustic transducer is constructed by incorporating a diaphragm 6 coupled to a voice coil 5 into the front surface, and the outer peripheral portion of the driver unit 7 is attached to a housing 8. The through hole 9 in the center of the driver unit 7 is filled with a sound absorbing material 10, the damping layer 12 is provided on the back side of the through hole 11, and the housing 8 is provided with several through holes 13 to provide frequency characteristics. is controlled.

従つて、上述の構成を音響等価回路で示すと、
第3図のようになる。ここで、Md、Cnd及びRd
は夫々振動系の等価質量、コンプライアンス及び
音響抵抗であり、Vsは信号源、Raは上記吸音材
10及び制動層12による音響抵抗であり、並列
回路を構成しているRb及びCbは夫々筐体8の透
孔13による音響抵抗と、筐体の後部空間(すな
わちバツクキヤビテイ)によるコンプライアンス
である。
Therefore, if the above configuration is expressed as an acoustic equivalent circuit,
It will look like Figure 3. Here, M d , C nd and R d
are the equivalent mass, compliance, and acoustic resistance of the vibration system, respectively, V s is the signal source, R a is the acoustic resistance due to the sound absorbing material 10 and damping layer 12, and R b and C b constitute a parallel circuit. are the acoustic resistance due to the through hole 13 of the housing 8 and the compliance due to the rear space (ie, back cavity) of the housing, respectively.

なお、この第3図において、符号Gで囲んだ
Mcup、Ccup及びRcupは夫々イヤホンを耳穴に挿着
した時に耳穴によつて形成される等価質量、コン
プライアンス及び音響抵抗である。
In addition, in this Figure 3, the symbol G is enclosed.
M cup , C cup and R cup are the equivalent mass, compliance and acoustic resistance formed by the ear canal when the earphone is inserted into the ear canal, respectively.

ところが、筐体8の透孔13により音響抵抗
RbはRaに比べて無視できる程小さく、またCd
殆ど無視できるから、並列回路をなすこれらRb
及びCbの効果は少なく、第3図における音響等
価回路はほぼMd、Cnd、Rd及びRaの直列共振回
路となる。従つて、前記の通り低音共振周波数0
はほほ01/2π√d ndで与えられて低くならず、 また第1図に示す如く、Raが小さいと0付近で
特性に山が生じて、その付近の音だけが強調され
て響く音になる。一方、Raが大きいと0より高
い周波数から特性が低下して来て、低音の再生が
充分でなくなる。
However, due to the through hole 13 in the housing 8, the acoustic resistance
Since R b is negligibly small compared to R a , and C d is also almost negligible, these R b
The effects of C and C b are small, and the acoustic equivalent circuit in FIG. 3 is approximately a series resonant circuit of M d , C nd , R d and R a . Therefore, as mentioned above, the bass resonance frequency is 0.
is given by 0 1/2π√ d nd and does not become low. Also, as shown in Figure 1, when R a is small, a peak appears in the characteristic near 0 , and only the sounds around that area are emphasized and resonate. It becomes a sound. On the other hand, when R a is large, the characteristics begin to deteriorate from frequencies higher than 0 , and bass reproduction becomes insufficient.

考案の目的 本考案は以上の実情に鑑みなされたもので、そ
の目的は、従来から用いられているドライバーユ
ニツト(すなわち音響変換器)の構造を特に変え
ることなく、この音響変換器の背面側の音響等価
回路を変えることによつて、低音域におけるレス
ポンスを改善することであり、換言すれば、小口
径で大口径級の低音域レスポンスを得ることがで
きるヘツドホーンを提供することにある。
Purpose of the invention The present invention was devised in view of the above-mentioned circumstances, and its purpose is to improve the rear side of the acoustic transducer without making any particular changes to the structure of the conventionally used driver unit (i.e., acoustic transducer). The object of the present invention is to improve the response in the low frequency range by changing the acoustic equivalent circuit. In other words, the object is to provide a headphone that can obtain a low frequency response comparable to that of a large diameter headphone with a small diameter.

考案の概要 本考案は、以上の目的を達成するため、音響変
換器と、この音響変換器が取付けられる筐体とか
ら成り、上記音響変換器の後面より出る音を外部
に放出し得ると共にその音響等価回路にインダク
タンス成分を付与するために内径よりも大きい長
さに選定されたダクト部を上記筐体に設けたもの
である。
Summary of the invention In order to achieve the above object, the present invention consists of an acoustic transducer and a casing to which the acoustic transducer is installed, and is capable of emitting sound emitted from the rear surface of the acoustic transducer to the outside. In order to add an inductance component to the acoustic equivalent circuit, a duct portion whose length is selected to be larger than the inner diameter is provided in the housing.

以上のように構成することにより、音響等価回
路全体としての低音共振周波数0が下げられるか
ら、低音域におけるレスポンスが改善され、従つ
て、これ迄と同じ音響変換器を用いても、従来の
ヘツドホンと異なつて低音域の充実した再生音を
得ることができる。
By configuring as described above, the bass resonance frequency 0 of the entire acoustic equivalent circuit is lowered, so the response in the bass range is improved. Unlike this, it is possible to obtain playback sound with a rich bass range.

実施例 以下において、本考案をインナーイヤー型ヘツ
ドホン(すなわちイヤホン)に適用した一実施例
を図面に基づいて説明する。
Embodiment Hereinafter, an embodiment in which the present invention is applied to an inner-ear headphone (ie, an earphone) will be described based on the drawings.

第4A図及び第4B図に示す如く、本考案のイ
ヤホンには、前記第2図に示したと同一の音響変
換器(すなわちドライバーユニツト)7が使用さ
れているので、前記のものと同一のものには同じ
符号を付してその説明を省略する。なお、この実
施例において、ドライバー7の背面の透孔11及
び中央の貫通孔9には、ナトロンメツシユ等の抵
抗成分がほぼゼロに等しい布やウレタン等の制動
材(すなわち吸音材)などを設けてもよい。
As shown in FIGS. 4A and 4B, the earphone of the present invention uses the same acoustic transducer (i.e. driver unit) 7 as shown in FIG. are given the same reference numerals and their explanations will be omitted. In this embodiment, the through hole 11 on the back side of the driver 7 and the central through hole 9 are provided with a damping material (i.e., sound absorbing material) such as cloth with a resistance component of almost zero, such as natron mesh, or urethane. Good too.

筐体20は、リード線21に関係する部分以外
は後方に円錐形状に絞られた形状に形成され、そ
の後端部には、夫々上方及び下方に向けられた上
側ダクト22及び下側ダクト23が形成されてい
る。そして、上側ダクト22は開口24を有して
おり、下側ダクト23には可撓性のジヨイント2
5が嵌入され、このジヨイント25を介してリー
ド線21が筐体20内に導入されている。なお、
これらのダクト22,23の長さは、それらの内
径(すなわち開口24の直径)よりもそれぞれ充
分に大きく選定されている。
The casing 20 is formed into a conical shape constricted at the rear except for the portion related to the lead wire 21, and an upper duct 22 and a lower duct 23 facing upward and downward, respectively, are formed at the rear end. It is formed. The upper duct 22 has an opening 24, and the lower duct 23 has a flexible joint 2.
5 is fitted into the housing 20, and a lead wire 21 is introduced into the housing 20 via this joint 25. In addition,
The lengths of these ducts 22, 23 are each selected to be sufficiently larger than their inner diameters (ie, the diameter of opening 24).

筐体20の側面には、複数個の透孔26が形成
され、これらの透孔26の内側面には、ウレタン
等から成る制動板27が設けられている。そし
て、筐体20の前部には、ドライバーユニツト7
の前面を覆うゆるやかに湾曲した円板形状の各種
の保護板が取付けられている。すなわち、これら
の保護板は、内側から順次、比較的大きな孔径の
メツシユのパンチングメタルから成りかつ外部か
らの圧力等からドライバーユニツト7を機械的に
保護する保護板28、その外側の基布から成る防
塵用の保護板29及び小孔径のメツシユのパンチ
ングメタルから成る耳穴用の保護板30から構成
されている。
A plurality of through holes 26 are formed on the side surface of the casing 20, and a brake plate 27 made of urethane or the like is provided on the inside surface of these through holes 26. The driver unit 7 is located at the front of the housing 20.
A variety of gently curved disk-shaped protection plates are installed to cover the front surface of the That is, these protection plates consist of, in order from the inside, the protection plate 28, which is made of punched metal with a mesh having a relatively large hole diameter and mechanically protects the driver unit 7 from external pressure, etc., and the base fabric on the outside of the protection plate 28. It is composed of a dust-proof protection plate 29 and an ear hole protection plate 30 made of punched metal with a mesh having a small hole diameter.

以上のように構成された本考案によるイヤホン
の音響等価回路を示すと第5図のようになる。こ
こに、Md、Cnd及びRdは夫々前記第3図の場合
と同様にドライバーユニツト7の振動系に関する
ものである。またRaはドライバー7の透孔11
及び中央の貫通孔9による音響抵抗でほぼRa
0である。またCbは筐体20を円錐形状に形成
したことによるバツクキヤビテイによるコンプラ
イアンス、Rbは制動板27による音響抵抗、Ld
及びR′dはダクト22,23によるインダクタン
ス(等価質量)及び音響抵抗で、R′dは非常に小
さい。従つて、本考案によるイヤホンの場合に
は、振動系の等価質量Mdにダクト22,23の
等価質量Ldが追加されている。このため、イヤ
ホンの背面側の制動はLd、Cb及びRbの並列共振
回路となり、これが前記Md、Cnd及びRdの直列
共振回路に加えられることになる。
FIG. 5 shows the acoustic equivalent circuit of the earphone according to the present invention constructed as described above. Here, M d , C nd and R d respectively relate to the vibration system of the driver unit 7, as in the case of FIG. 3 above. Also, R a is the through hole 11 of the driver 7.
And due to the acoustic resistance due to the central through hole 9, approximately R a
It is 0. Further, C b is the compliance due to the back cavity due to the conical shape of the housing 20, R b is the acoustic resistance due to the brake plate 27, and L d
and R' d are the inductance (equivalent mass) and acoustic resistance due to the ducts 22 and 23, and R' d is very small. Therefore, in the case of the earphone according to the present invention, the equivalent mass L d of the ducts 22 and 23 is added to the equivalent mass M d of the vibration system. Therefore, the braking on the back side of the earphone is a parallel resonant circuit of L d , C b , and R b , which is applied to the series resonant circuit of M d , C nd , and R d .

上述の通りであるから、このイヤホンの音響等
価回路全体としての低音共振周波数は、第6図に
示す如く、インダクタンス(等価質量)Ld分に
よつて、ドライバーユニツト7自体の低音共振周
波数0よりも低い′0に下げられるから、音域、
特に低音域を広げることができる。また第6図に
示す如く、Ldに並列に入る抵抗分Rbを小さくす
ると′0は上昇し、一方、Rbを大きくすると中域
が落ち込む。従つてLdに対しRbを適当に選ぶこ
とによつて、音域を広げると共に低音域から高音
域まで平坦化したり、音域を広げた状態で高音域
を増強したり、或いは所望の周波数特性を得るよ
うにしたりすることができる。
As mentioned above, the bass resonance frequency of the entire acoustic equivalent circuit of this earphone is determined by the inductance (equivalent mass) L d from the bass resonance frequency 0 of the driver unit 7 itself, as shown in Fig. 6. is also lowered to a low ′ 0 , so the range,
In particular, it can widen the bass range. Further, as shown in FIG. 6, when the resistance R b connected in parallel with L d is reduced, '0' increases, while when R b is increased, the midrange falls. Therefore, by appropriately selecting R b with respect to L d , it is possible to widen the range and flatten the range from bass to treble, enhance the treble range while widening the range, or obtain desired frequency characteristics. You can try to get it.

また高域に関しては、Rbを大にすると聴感上
ヘツドホン再生において必要な高域のレベルが向
上する。
Regarding high frequencies, increasing Rb increases the level of high frequencies necessary for headphone reproduction in terms of hearing.

なお、例えば、第4図におけるダクト22の長
さl及び/又は制動板27を可変とすることによ
つて、音響制御を行うこともできる。
Note that, for example, acoustic control can also be performed by making the length l of the duct 22 and/or the brake plate 27 in FIG. 4 variable.

第7図は、第2図に示した従来のイヤホンにお
ける音圧−周波数特性Aと、これと同一のドライ
バーユニツトを使用し、第4A図及び第4B図に
示すダクト22のようにφ3×20mmのダクトを設
けた本考案によるイヤホンにおける音圧−周波数
特性Bとの比較を示したものである。この図より
明らかなように、0が220Hzから150Hzに下がつて
いることが分かる。またヘツドホン再生において
必要な4KHz近辺の高域のレベルが上昇すること
も分かる。なお第2図及び第4図共にユニツトは
φ16口径のものである。
Fig. 7 shows the sound pressure-frequency characteristic A of the conventional earphone shown in Fig. 2, and using the same driver unit as this, the duct 22 shown in Figs. 4A and 4B has a diameter of 3 mm x 20 mm. This figure shows a comparison with the sound pressure-frequency characteristic B of the earphone according to the present invention, which is provided with a duct. As is clear from this figure, 0 is decreasing from 220Hz to 150Hz. It can also be seen that the level of high frequencies around 4KHz, which is necessary for headphone playback, increases. The unit in both FIGS. 2 and 4 has a diameter of φ16.

第8図に示したものは、ダクト31の形状を逆
U字形としてその開口32を下向きにすることに
よつて防塵を考慮し、またダクト31の長さを所
望により長くした第2の実施例を示したもので、
その他の点においては前記第1の実施例で説明し
たものと全く同じである。そして、ダクト31の
形状を逆U字状にしても、このダクト31が前記
インダクタンス(等価質量)Ldとしての作用効
果を発揮することは明らかであるから、全体とし
て、この第2の実施例におけるイヤホンも前記第
1の実施例におけるイヤホンと同様の作用効果を
発揮することができる。
The second embodiment shown in FIG. 8 is a second embodiment in which the shape of the duct 31 is inverted U-shaped and the opening 32 is directed downward in consideration of dust prevention, and the length of the duct 31 is made longer as desired. It shows
In other respects, this embodiment is exactly the same as that described in the first embodiment. Even if the shape of the duct 31 is made into an inverted U-shape, it is clear that this duct 31 exhibits the function and effect as the inductance (equivalent mass) L d , so overall, this second embodiment The earphone in Embodiment 1 can also exhibit the same effects as the earphone in the first embodiment.

考案の効果 以上説明したように、本考案のヘツドホンは、
音響変換器と、この音響変換器が取付けられる筐
体とから成り、上記音響変換器の後面より出る音
を外部に放出し得ると共にその音響等価回路にイ
ンダクタンス成分を付与するために内径よりも大
きい長さに選定されたダクト部を上記筐体に設け
たものである。
Effects of the invention As explained above, the headphone of the invention has the following effects:
It consists of an acoustic transducer and a casing to which the acoustic transducer is attached, and is larger than the inner diameter in order to be able to emit the sound emitted from the rear surface of the acoustic transducer to the outside and to add an inductance component to the acoustic equivalent circuit. A duct portion having a selected length is provided in the above-mentioned housing.

従つて、上記ダクト部によるインダクタンス分
が音響変換器の音響等価回路に加えられるから、
本考案によるヘツドホンの音響等価回路全体とし
ての低音共振周波数が上記インダクタンス分によ
つて音響変換器自体の低音共振周波数よりも低い
値に下げられる。従つて、本考案によれば、低音
域におけるレスポンスが改善され、このため、同
一サイズの音響変換器を用いたヘツドホンであつ
ても、従来型のものとは異なつて低音域の充実し
た再生音を得ることができる。そして、低音域に
ついて述べれば、小口径でも大口径級のレスポン
スが得られて極めて有利である。
Therefore, since the inductance due to the duct section is added to the acoustic equivalent circuit of the acoustic transducer,
The bass resonance frequency of the entire acoustic equivalent circuit of the headphone according to the present invention is lowered by the inductance to a value lower than the bass resonance frequency of the acoustic transducer itself. Therefore, according to the present invention, the response in the bass range is improved, and therefore, even if the headphone uses the same size acoustic transducer, it can reproduce sound with a rich bass range, unlike conventional headphones. can be obtained. And speaking of the bass range, even with a small diameter, you can get the response of a large diameter, which is extremely advantageous.

【図面の簡単な説明】[Brief explanation of drawings]

第1図は従来のヘツドホンの音圧特性図、第2
図及び第3図は従来型ヘツドホンの中心縦断面図
とその音響等価回路図、第4図〜第6図は本考案
によるイヤホンの一実施例を示すもので、第4A
図は中心縦断面図、第4B図は外観斜視図、第5
図は音響等価回路図、第6図は低音特性図、第7
図は従来型と本考案によるものとの音圧−周波数
特性比較図、第8図は本考案による第2の実施例
を示す外観斜視図である。 なお図面に用いた符号において、1……マグネ
ツト、2……ヨーク、3……プレート、4……磁
気ギヤツプ、5……ボイスコイル、6……振動
板、7……ドライバーユニツト(音響変換器)、
20……筐体、22,23,31……ダクト、2
6……透孔、27……制動板、である。
Figure 1 is a sound pressure characteristic diagram of conventional headphones;
Figures 4 and 3 show a central longitudinal sectional view of a conventional headphone and its acoustic equivalent circuit diagram, and Figures 4 to 6 show an embodiment of the earphone according to the present invention.
The figure is a central vertical sectional view, Figure 4B is an external perspective view, and Figure 5
The figure is an acoustic equivalent circuit diagram, Figure 6 is a bass characteristic diagram, and Figure 7 is a diagram of bass characteristics.
The figure is a comparison diagram of the sound pressure-frequency characteristics of the conventional type and the one according to the present invention, and FIG. 8 is an external perspective view showing a second embodiment according to the present invention. In addition, in the symbols used in the drawings, 1...Magnet, 2...Yoke, 3...Plate, 4...Magnetic gap, 5...Voice coil, 6...Diaphragm, 7...Driver unit (acoustic transducer) ),
20... Housing, 22, 23, 31... Duct, 2
6... through hole, 27... brake plate.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] 音響変換器と、この音響変換器が取付けられる
筐体とから成り、上記音響変換器の後面より出る
音を外部に放出し得ると共にその音響等価回路に
インダクタンス成分を付与するために内径よりも
大きい長さに選定されたダクト部を上記筐体に設
けたことを特徴とするヘツドホン。
Consisting of an acoustic transducer and a housing to which this acoustic transducer is attached, the housing is larger than the inner diameter in order to be able to emit the sound emitted from the rear surface of the acoustic transducer to the outside and to add an inductance component to the acoustic equivalent circuit. A headphone characterized in that a duct portion having a selected length is provided in the casing.
JP7105583U 1983-05-12 1983-05-12 headphone Granted JPS59177287U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP7105583U JPS59177287U (en) 1983-05-12 1983-05-12 headphone

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP7105583U JPS59177287U (en) 1983-05-12 1983-05-12 headphone

Publications (2)

Publication Number Publication Date
JPS59177287U JPS59177287U (en) 1984-11-27
JPS646636Y2 true JPS646636Y2 (en) 1989-02-21

Family

ID=30201208

Family Applications (1)

Application Number Title Priority Date Filing Date
JP7105583U Granted JPS59177287U (en) 1983-05-12 1983-05-12 headphone

Country Status (1)

Country Link
JP (1) JPS59177287U (en)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0450718Y2 (en) * 1986-02-28 1992-11-30
JP4831176B2 (en) * 2009-01-29 2011-12-07 日本ビクター株式会社 headphone
JP5592622B2 (en) * 2009-08-25 2014-09-17 モレックス インコーポレイテド earphone
JP6459974B2 (en) 2013-11-19 2019-01-30 ソニー株式会社 Headphone and acoustic characteristic adjustment method
JP2016076883A (en) * 2014-10-08 2016-05-12 Pioneer DJ株式会社 headphone

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5758860U (en) * 1980-09-25 1982-04-07

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5758860U (en) * 1980-09-25 1982-04-07

Also Published As

Publication number Publication date
JPS59177287U (en) 1984-11-27

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