JPS6465897A - Removal of resin smear of printed board - Google Patents

Removal of resin smear of printed board

Info

Publication number
JPS6465897A
JPS6465897A JP22274087A JP22274087A JPS6465897A JP S6465897 A JPS6465897 A JP S6465897A JP 22274087 A JP22274087 A JP 22274087A JP 22274087 A JP22274087 A JP 22274087A JP S6465897 A JPS6465897 A JP S6465897A
Authority
JP
Japan
Prior art keywords
board
chemical
holes
smear
end parts
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP22274087A
Other languages
Japanese (ja)
Inventor
Kenichi Kobayashi
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fujitsu Ltd
Original Assignee
Fujitsu Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fujitsu Ltd filed Critical Fujitsu Ltd
Priority to JP22274087A priority Critical patent/JPS6465897A/en
Publication of JPS6465897A publication Critical patent/JPS6465897A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0085—Apparatus for treatments of printed circuits with liquids not provided for in groups H05K3/02 - H05K3/46; conveyors and holding means therefor
    • H05K3/0088—Apparatus for treatments of printed circuits with liquids not provided for in groups H05K3/02 - H05K3/46; conveyors and holding means therefor for treatment of holes

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Cleaning By Liquid Or Steam (AREA)

Abstract

PURPOSE:To remove resin smears effectively, by empolying a series of processes in which a printed board is steeped in a chemical, both the end parts of the board are then made to rise and fall by turns using the center part of the board as a fulcrum. CONSTITUTION:A printed board 8 is steeped horizontally in a chemical so that the extending direction of hole 9 of the board 9 is perpendicular to the level of the chemical. As a result, during a smear 11 is dissolved in the chemical, gases which are generated in the holes 9 are easily released therefrom upward so that the chemical 12 fills in the holes 9 easily, which enhances the efficiency of the dissolution of the smear. Moreover, when both the end parts B and C of the board 8 are made to rise and fall by turns using the center part A of the board as a fulcrum, the chemical 12 fills in the holes 9 with being pressured so that the dissolution of the smear in the holes 9 is accelerated. Now, the mechanical shock is applied to both the end parts B and C in accordance with this vertical motion of the board 8, which promotes effectively the elimination of the smear sticking in the holes 9.
JP22274087A 1987-09-04 1987-09-04 Removal of resin smear of printed board Pending JPS6465897A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP22274087A JPS6465897A (en) 1987-09-04 1987-09-04 Removal of resin smear of printed board

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP22274087A JPS6465897A (en) 1987-09-04 1987-09-04 Removal of resin smear of printed board

Publications (1)

Publication Number Publication Date
JPS6465897A true JPS6465897A (en) 1989-03-13

Family

ID=16787159

Family Applications (1)

Application Number Title Priority Date Filing Date
JP22274087A Pending JPS6465897A (en) 1987-09-04 1987-09-04 Removal of resin smear of printed board

Country Status (1)

Country Link
JP (1) JPS6465897A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH04298274A (en) * 1991-03-27 1992-10-22 Mitsubishi Heavy Ind Ltd Ultrasonic cleaning method
JP2002232151A (en) * 2001-01-30 2002-08-16 Sony Corp System and method for processing substrate

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5784194A (en) * 1980-11-14 1982-05-26 Hitachi Ltd Method of producing multilayer printed circuit board

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5784194A (en) * 1980-11-14 1982-05-26 Hitachi Ltd Method of producing multilayer printed circuit board

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH04298274A (en) * 1991-03-27 1992-10-22 Mitsubishi Heavy Ind Ltd Ultrasonic cleaning method
JP2002232151A (en) * 2001-01-30 2002-08-16 Sony Corp System and method for processing substrate

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