JPS646459A - Execution structure of heating floor panel - Google Patents
Execution structure of heating floor panelInfo
- Publication number
- JPS646459A JPS646459A JP15840887A JP15840887A JPS646459A JP S646459 A JPS646459 A JP S646459A JP 15840887 A JP15840887 A JP 15840887A JP 15840887 A JP15840887 A JP 15840887A JP S646459 A JPS646459 A JP S646459A
- Authority
- JP
- Japan
- Prior art keywords
- projected portion
- floor panel
- floor
- top surface
- panel
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Abstract
PURPOSE: To make the maintenance easier by connecting a projected portion at one end of a floor heating panel to the top surface of fitting projected portion of peripheral floor panels and connecting the projected portion at the other end to the top surface of a connected equipment and materials fitted to a projected portion of the peripheral floor panel. CONSTITUTION: A floor heating panel A is fixed from the upper side to the floor backing with an attaching device 9 at a plug hole 8. Also, it is fitted to a recessed portion 11 in the lower surface of the connecting projected portion 4 between the floor panel A. And the connecting projected portion 4 at one end of the floor panel A is placed and connected to the top surface of a fitting projected portion 2 of the peripheral floor panel 3 facing the projected portion 4. in addition, connecting projected portion 4 at the other end of the floor panel A is placed and connected to the top surface of connected equipment and materials 5 fitted to the fitting projected portion 2 of the floor panel 3 facing the projected portion 4.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP15840887A JPH07116823B2 (en) | 1987-06-25 | 1987-06-25 | Heated floor panel construction structure |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP15840887A JPH07116823B2 (en) | 1987-06-25 | 1987-06-25 | Heated floor panel construction structure |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS646459A true JPS646459A (en) | 1989-01-11 |
JPH07116823B2 JPH07116823B2 (en) | 1995-12-18 |
Family
ID=15671102
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP15840887A Expired - Fee Related JPH07116823B2 (en) | 1987-06-25 | 1987-06-25 | Heated floor panel construction structure |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH07116823B2 (en) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0552081U (en) * | 1991-12-24 | 1993-07-09 | 松下電工株式会社 | Floor material for floor heating |
WO2014139294A1 (en) * | 2013-03-15 | 2014-09-18 | Deng Ciyi | Lapped glue floor board |
-
1987
- 1987-06-25 JP JP15840887A patent/JPH07116823B2/en not_active Expired - Fee Related
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0552081U (en) * | 1991-12-24 | 1993-07-09 | 松下電工株式会社 | Floor material for floor heating |
WO2014139294A1 (en) * | 2013-03-15 | 2014-09-18 | Deng Ciyi | Lapped glue floor board |
Also Published As
Publication number | Publication date |
---|---|
JPH07116823B2 (en) | 1995-12-18 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
LAPS | Cancellation because of no payment of annual fees |