JPS6464213A - Monitor system of manufacturing facility - Google Patents

Monitor system of manufacturing facility

Info

Publication number
JPS6464213A
JPS6464213A JP21903987A JP21903987A JPS6464213A JP S6464213 A JPS6464213 A JP S6464213A JP 21903987 A JP21903987 A JP 21903987A JP 21903987 A JP21903987 A JP 21903987A JP S6464213 A JPS6464213 A JP S6464213A
Authority
JP
Japan
Prior art keywords
work
quality
maintenance
lot
retrieved
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP21903987A
Other languages
Japanese (ja)
Other versions
JPH0652698B2 (en
Inventor
Toshimasa Harada
Jun Nakazato
Tsutomu Tsuyama
Takemasa Iwasaki
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP62219039A priority Critical patent/JPH0652698B2/en
Publication of JPS6464213A publication Critical patent/JPS6464213A/en
Publication of JPH0652698B2 publication Critical patent/JPH0652698B2/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

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  • General Factory Administration (AREA)

Abstract

PURPOSE:To keep previously set performance for a prolonged term by providing a variation detecting arithmetic means controlling the quality of a work after maintenance work as to whether or not the quality is maintained at a specified value and monitoring the fluctuation of the conditions of treatment of the work after the maintenance management and maintenance work of manufacturing facilities. CONSTITUTION:The current execution day when maintenance work to be examined is executed is retrieved from maintenance experience data 105. Information related to the time of treatment regarding a lot immediately after maintenance work is executed from production experience data 101 on the basis of the information of the current execution day, and all lot numbers up to the current time from the lot are retrieved from older numbers in order of time series. The measured values of the result of treatment of a work corresponding to these lot numbers are retrieved from quality data 102. The satisfaction of specifications specified by quality specified data 103 is judged from of these information, and the presence of the generation of variation is controlled.
JP62219039A 1987-09-03 1987-09-03 Manufacturing equipment monitoring method Expired - Fee Related JPH0652698B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP62219039A JPH0652698B2 (en) 1987-09-03 1987-09-03 Manufacturing equipment monitoring method

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP62219039A JPH0652698B2 (en) 1987-09-03 1987-09-03 Manufacturing equipment monitoring method

Publications (2)

Publication Number Publication Date
JPS6464213A true JPS6464213A (en) 1989-03-10
JPH0652698B2 JPH0652698B2 (en) 1994-07-06

Family

ID=16729298

Family Applications (1)

Application Number Title Priority Date Filing Date
JP62219039A Expired - Fee Related JPH0652698B2 (en) 1987-09-03 1987-09-03 Manufacturing equipment monitoring method

Country Status (1)

Country Link
JP (1) JPH0652698B2 (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6295478B1 (en) 1997-08-29 2001-09-25 Nec Corporation Manufacturing process change control apparatus and manufacturing process change control method
JP2018014427A (en) * 2016-07-21 2018-01-25 株式会社日立国際電気 Substrate processing device, method for manufacturing semiconductor device, and program

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS60233709A (en) * 1984-12-05 1985-11-20 Hitachi Ltd Integrated security controller

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS60233709A (en) * 1984-12-05 1985-11-20 Hitachi Ltd Integrated security controller

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6295478B1 (en) 1997-08-29 2001-09-25 Nec Corporation Manufacturing process change control apparatus and manufacturing process change control method
JP2018014427A (en) * 2016-07-21 2018-01-25 株式会社日立国際電気 Substrate processing device, method for manufacturing semiconductor device, and program

Also Published As

Publication number Publication date
JPH0652698B2 (en) 1994-07-06

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Legal Events

Date Code Title Description
LAPS Cancellation because of no payment of annual fees