JPS6455815A - Sputtering apparatus for manufacturing thin magnetic film - Google Patents
Sputtering apparatus for manufacturing thin magnetic filmInfo
- Publication number
- JPS6455815A JPS6455815A JP21365587A JP21365587A JPS6455815A JP S6455815 A JPS6455815 A JP S6455815A JP 21365587 A JP21365587 A JP 21365587A JP 21365587 A JP21365587 A JP 21365587A JP S6455815 A JPS6455815 A JP S6455815A
- Authority
- JP
- Japan
- Prior art keywords
- target
- substrate
- magnetic film
- gas
- permanent magnet
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Physical Vapour Deposition (AREA)
- Thin Magnetic Films (AREA)
Abstract
PURPOSE:To efficiently form a magnetic film having uniform magnetic properties by so disposing a first permanent magnet that the same poles face at the position for surrounding between a target and a substrate, and so disposing a second permanent magnet that a reverse pole to the pole faces the target around the center of the target on the rear face of the target. CONSTITUTION:After a substrate 10 is heated, discharging Ar gas is introduced from a gate introduction system into a vacuum vessel, and the vessel is held in vacuum of approx. 10<-5>Torr. Then, a negative high potential is applied to a target 7 of a ferromagnetic metal material to ionize the Ar gas to Ar<+>. In this case, lines 21 of magnetic force from first permanent magnets 19a, 19b, 19c, 19d substantially uniformly pass through the whole target 7 to a second permanent magnet 20. Thus, since second electrons for ionizing the Ar gas are substantially uniformly enclosed in the whole area on the target 7, the Ar<+> collides uniformly with the target 7 in high density to discharge atoms 22. The discharged atoms 22 collide substantially perpendicularly with the substrate 10 to form a magnetic film 23 having a columnar structure 26 perpendicular to the surface of the substrate 10..
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP21365587A JPS6455815A (en) | 1987-08-27 | 1987-08-27 | Sputtering apparatus for manufacturing thin magnetic film |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP21365587A JPS6455815A (en) | 1987-08-27 | 1987-08-27 | Sputtering apparatus for manufacturing thin magnetic film |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS6455815A true JPS6455815A (en) | 1989-03-02 |
Family
ID=16642760
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP21365587A Pending JPS6455815A (en) | 1987-08-27 | 1987-08-27 | Sputtering apparatus for manufacturing thin magnetic film |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS6455815A (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH07166349A (en) * | 1993-12-13 | 1995-06-27 | Anelva Corp | Flat pate magnetron sputtering device |
-
1987
- 1987-08-27 JP JP21365587A patent/JPS6455815A/en active Pending
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH07166349A (en) * | 1993-12-13 | 1995-06-27 | Anelva Corp | Flat pate magnetron sputtering device |
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