JPS6454742A - Bonding method and device - Google Patents

Bonding method and device

Info

Publication number
JPS6454742A
JPS6454742A JP62210123A JP21012387A JPS6454742A JP S6454742 A JPS6454742 A JP S6454742A JP 62210123 A JP62210123 A JP 62210123A JP 21012387 A JP21012387 A JP 21012387A JP S6454742 A JPS6454742 A JP S6454742A
Authority
JP
Japan
Prior art keywords
wire
heated
bonding
capillary
arm
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP62210123A
Other languages
Japanese (ja)
Inventor
Takeshi Hasegawa
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Renesas Semiconductor Package and Test Solutions Co Ltd
Original Assignee
Hitachi Ltd
Hitachi Yonezawa Electronics Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd, Hitachi Yonezawa Electronics Co Ltd filed Critical Hitachi Ltd
Priority to JP62210123A priority Critical patent/JPS6454742A/en
Publication of JPS6454742A publication Critical patent/JPS6454742A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
    • H01L24/78—Apparatus for connecting with wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/78—Apparatus for connecting with wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/78—Apparatus for connecting with wire connectors
    • H01L2224/7825—Means for applying energy, e.g. heating means
    • H01L2224/783—Means for applying energy, e.g. heating means by means of pressure
    • H01L2224/78301—Capillary
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01082—Lead [Pb]

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Wire Bonding (AREA)

Abstract

PURPOSE:To conduct bonding not peeled after joining by installing a film heater to an arm, to which a jig supporting a wire as a body to be bonded is mounted, and heating the wire through the arm and the jig. CONSTITUTION:A wire 11 is penetrated through a capillary 6 through a clamper 14. A film heater 3 is conducted and a conductor 4 is heated, the nose of a first arm 2 is heated, and the wire 11 is heated through the capillary 6. The tip of the wire 11 is melted, and supported as heat transfer from the capillary 6 is left as it is kept. Since a lead frame as a bonding body is heated and a fixed temperature is kept, on the other hand, the dispersion of a contact bonding temperature is reduced when the wire is joined, and the wire can be joined at a desired contact bonding temperature, thus improving contact bonding properties, then preventing peeling after bonding and enhancing reliability.
JP62210123A 1987-08-26 1987-08-26 Bonding method and device Pending JPS6454742A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP62210123A JPS6454742A (en) 1987-08-26 1987-08-26 Bonding method and device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP62210123A JPS6454742A (en) 1987-08-26 1987-08-26 Bonding method and device

Publications (1)

Publication Number Publication Date
JPS6454742A true JPS6454742A (en) 1989-03-02

Family

ID=16584178

Family Applications (1)

Application Number Title Priority Date Filing Date
JP62210123A Pending JPS6454742A (en) 1987-08-26 1987-08-26 Bonding method and device

Country Status (1)

Country Link
JP (1) JPS6454742A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPWO2013111452A1 (en) * 2012-01-26 2015-05-11 株式会社新川 Antioxidant gas blowing unit

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPWO2013111452A1 (en) * 2012-01-26 2015-05-11 株式会社新川 Antioxidant gas blowing unit

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