JPS645446U - - Google Patents
Info
- Publication number
- JPS645446U JPS645446U JP9871187U JP9871187U JPS645446U JP S645446 U JPS645446 U JP S645446U JP 9871187 U JP9871187 U JP 9871187U JP 9871187 U JP9871187 U JP 9871187U JP S645446 U JPS645446 U JP S645446U
- Authority
- JP
- Japan
- Prior art keywords
- mold
- dummy frame
- cavity
- hole corresponding
- air vent
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000011347 resin Substances 0.000 claims description 2
- 229920005989 resin Polymers 0.000 claims description 2
- 238000004140 cleaning Methods 0.000 claims 1
- 238000005520 cutting process Methods 0.000 description 1
Landscapes
- Injection Moulding Of Plastics Or The Like (AREA)
- Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP9871187U JPH0510359Y2 (US07321065-20080122-C00160.png) | 1987-06-26 | 1987-06-26 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP9871187U JPH0510359Y2 (US07321065-20080122-C00160.png) | 1987-06-26 | 1987-06-26 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS645446U true JPS645446U (US07321065-20080122-C00160.png) | 1989-01-12 |
| JPH0510359Y2 JPH0510359Y2 (US07321065-20080122-C00160.png) | 1993-03-15 |
Family
ID=31325217
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP9871187U Expired - Lifetime JPH0510359Y2 (US07321065-20080122-C00160.png) | 1987-06-26 | 1987-06-26 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0510359Y2 (US07321065-20080122-C00160.png) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2010010702A (ja) * | 2000-08-04 | 2010-01-14 | Renesas Technology Corp | 半導体装置の製造方法 |
| JP2012114305A (ja) * | 2010-11-26 | 2012-06-14 | Apic Yamada Corp | ダミーフレーム及び樹脂モールド方法 |
| JP2016042587A (ja) * | 2015-10-29 | 2016-03-31 | アピックヤマダ株式会社 | ダミーフレーム、樹脂モールド評価方法、モールド金型の評価方法、およびモールド金型の製造方法 |
-
1987
- 1987-06-26 JP JP9871187U patent/JPH0510359Y2/ja not_active Expired - Lifetime
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2010010702A (ja) * | 2000-08-04 | 2010-01-14 | Renesas Technology Corp | 半導体装置の製造方法 |
| JP2012114305A (ja) * | 2010-11-26 | 2012-06-14 | Apic Yamada Corp | ダミーフレーム及び樹脂モールド方法 |
| JP2016042587A (ja) * | 2015-10-29 | 2016-03-31 | アピックヤマダ株式会社 | ダミーフレーム、樹脂モールド評価方法、モールド金型の評価方法、およびモールド金型の製造方法 |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0510359Y2 (US07321065-20080122-C00160.png) | 1993-03-15 |
