JPS6454349U - - Google Patents

Info

Publication number
JPS6454349U
JPS6454349U JP1987148325U JP14832587U JPS6454349U JP S6454349 U JPS6454349 U JP S6454349U JP 1987148325 U JP1987148325 U JP 1987148325U JP 14832587 U JP14832587 U JP 14832587U JP S6454349 U JPS6454349 U JP S6454349U
Authority
JP
Japan
Prior art keywords
reflector
recess
light emitting
display device
emitting display
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1987148325U
Other languages
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1987148325U priority Critical patent/JPS6454349U/ja
Publication of JPS6454349U publication Critical patent/JPS6454349U/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/42—Wire connectors; Manufacturing methods related thereto
    • H01L24/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
    • H01L24/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
    • H01L2224/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
    • H01L2224/321—Disposition
    • H01L2224/32151—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/32221—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/32245—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/484—Connecting portions
    • H01L2224/48463—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond
    • H01L2224/48465—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond the other connecting portion not on the bonding area being a wedge bond, i.e. ball-to-wedge, regular stitch
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73251—Location after the connecting process on different surfaces
    • H01L2224/73265—Layer and wire connectors

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Illuminated Signs And Luminous Advertising (AREA)

Description

【図面の簡単な説明】[Brief explanation of the drawing]

第１図乃至第３図は本考案に係る発光表示装置
の一実施例を示し、第１図は断面図、第２図ａ，
ｂ，ｃはレフレクタの底部変形例を示した一部平
面図、第３図ａ，ｂ，ｃ，ｄはレフレクタの底部
の変形例を示した断面図である。第４図および第
５図は従来の発光表示装置を示した断面図および
平面図である。 ２……レフレクタ、２０……凹部、２１……底
部、２２……傾斜側部、３……ＬＥＤチツプ、３
２……導電接着剤。 1 to 3 show an embodiment of a light emitting display device according to the present invention, in which FIG. 1 is a sectional view, FIG.
FIGS. 3b and 3c are partial plan views showing modified examples of the bottom of the reflector, and FIGS. 3a, b, c, and d are sectional views showing modified examples of the bottom of the reflector. 4 and 5 are a sectional view and a plan view showing a conventional light emitting display device. 2...Reflector, 20...Recess, 21...Bottom, 22...Slanted side part, 3...LED chip, 3
2... Conductive adhesive.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] 開口側を幅広とした錐形の凹部を設けたレフレ
クタと、そのレフレクタの凹部の底部に導電接着
剤で固定したＬＥＤチツプとを備え、前記レフレ
クタの凹部の傾斜側部の表面を鏡面仕上げし、か
つレフレクタの凹部の底部の表面を荒くしたこと
を特徴とする発光表示装置。 A reflector having a conical recess with a wide opening side and an LED chip fixed to the bottom of the recess of the reflector with a conductive adhesive, the surface of the inclined side of the recess of the reflector having a mirror finish, A light emitting display device characterized in that the bottom surface of the recessed portion of the reflector is roughened.
JP1987148325U 1987-09-30 1987-09-30 Pending JPS6454349U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1987148325U JPS6454349U (en) 1987-09-30 1987-09-30

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1987148325U JPS6454349U (en) 1987-09-30 1987-09-30

Publications (1)

Publication Number Publication Date
JPS6454349U true JPS6454349U (en) 1989-04-04

Family

ID=31419541

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1987148325U Pending JPS6454349U (en) 1987-09-30 1987-09-30

Country Status (1)

Country Link
JP (1) JPS6454349U (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2009105161A (en) * 2007-10-22 2009-05-14 Panasonic Electric Works Co Ltd Light-emitting device

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS60261181A (en) * 1984-06-07 1985-12-24 Toshiba Corp Semiconductor device
JPS6216584A (en) * 1985-07-16 1987-01-24 Toshiba Corp Optical semiconductor element

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS60261181A (en) * 1984-06-07 1985-12-24 Toshiba Corp Semiconductor device
JPS6216584A (en) * 1985-07-16 1987-01-24 Toshiba Corp Optical semiconductor element

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2009105161A (en) * 2007-10-22 2009-05-14 Panasonic Electric Works Co Ltd Light-emitting device

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