JPH0371663U - - Google Patents
Info
- Publication number
- JPH0371663U JPH0371663U JP13351889U JP13351889U JPH0371663U JP H0371663 U JPH0371663 U JP H0371663U JP 13351889 U JP13351889 U JP 13351889U JP 13351889 U JP13351889 U JP 13351889U JP H0371663 U JPH0371663 U JP H0371663U
- Authority
- JP
- Japan
- Prior art keywords
- led
- main body
- receiving part
- body receiving
- led holder
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000758 substrate Substances 0.000 claims description 2
- 238000010521 absorption reaction Methods 0.000 claims 1
Description
第1図は本考案に係るLEDホルダの一実施例
を示す斜視図、第2図はLEDホルダを基板に取
り付けた状態を示す側面図、第3図及び第4図は
本考案に係るLEDホルダのそれぞれ別の実施例
を示す斜視図、第5図は従来のLEDホルダをL
EDとともに基板に取り付けた状態を示す斜視図
、第6図は第5図の分解斜視図、第7図はLED
の正面図、第8図は従来のLEDホルダをLED
とともに基板に取り付けた状態を示す側面図であ
る。
12……基板、13……LED、13a……L
ED本体、13d,13e……余肉部、21……
LEDホルダ、21a……本体受け部、21b…
…凹部。
Fig. 1 is a perspective view showing an embodiment of the LED holder according to the present invention, Fig. 2 is a side view showing the state where the LED holder is attached to the board, and Figs. 3 and 4 are the LED holder according to the present invention. FIG. 5 is a perspective view showing different embodiments of the conventional LED holder.
A perspective view showing the state attached to the board together with the ED, Figure 6 is an exploded perspective view of Figure 5, and Figure 7 is the LED.
Figure 8 shows the front view of the conventional LED holder.
FIG. 3 is a side view showing a state where the device is attached to a substrate. 12... Board, 13... LED, 13a...L
ED main body, 13d, 13e...Excess flesh part, 21...
LED holder, 21a...main body receiving part, 21b...
...concavity.
Claims (1)
取り付ける際に用いられるLEDホルダにおいて
、前記LED本体と嵌合する本体受け部が形成さ
れ、該本体受け部に連設して前記LED形状のバ
ラツキ分を吸収する凹部が形成されていることを
特徴とするLEDホルダ。 In an LED holder used when attaching a light emitting diode (hereinafter referred to as LED) to a substrate, a main body receiving part that fits with the LED main body is formed, and a main body receiving part is connected to the main body receiving part to compensate for variations in the shape of the LED. An LED holder characterized in that a recess for absorption is formed.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP13351889U JPH0371663U (en) | 1989-11-16 | 1989-11-16 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP13351889U JPH0371663U (en) | 1989-11-16 | 1989-11-16 |
Publications (1)
Publication Number | Publication Date |
---|---|
JPH0371663U true JPH0371663U (en) | 1991-07-19 |
Family
ID=31680920
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP13351889U Pending JPH0371663U (en) | 1989-11-16 | 1989-11-16 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH0371663U (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2008542590A (en) * | 2005-06-05 | 2008-11-27 | 斌 徐 | Modular comb-type bridge joint device that can withstand oversized displacement |
-
1989
- 1989-11-16 JP JP13351889U patent/JPH0371663U/ja active Pending
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2008542590A (en) * | 2005-06-05 | 2008-11-27 | 斌 徐 | Modular comb-type bridge joint device that can withstand oversized displacement |
JP4641558B2 (en) * | 2005-06-05 | 2011-03-02 | 斌 徐 | Modular comb-type bridge joint device that can withstand oversized displacement |