JPS6454055A - Resin composition - Google Patents

Resin composition

Info

Publication number
JPS6454055A
JPS6454055A JP63122665A JP12266588A JPS6454055A JP S6454055 A JPS6454055 A JP S6454055A JP 63122665 A JP63122665 A JP 63122665A JP 12266588 A JP12266588 A JP 12266588A JP S6454055 A JPS6454055 A JP S6454055A
Authority
JP
Japan
Prior art keywords
resin composition
molding
dimensional stability
resistance
resin
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP63122665A
Other languages
English (en)
Inventor
Mitsuhiko Tamura
Masaaki Miyamoto
Kazuo Miyamoto
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Kasei Corp
Original Assignee
Mitsubishi Kasei Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Kasei Corp filed Critical Mitsubishi Kasei Corp
Priority to JP63122665A priority Critical patent/JPS6454055A/ja
Publication of JPS6454055A publication Critical patent/JPS6454055A/ja
Pending legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L67/00—Compositions of polyesters obtained by reactions forming a carboxylic ester link in the main chain; Compositions of derivatives of such polymers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B3/00—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties
    • H01B3/18—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances
    • H01B3/30—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances plastics; resins; waxes
    • H01B3/42—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances plastics; resins; waxes polyesters; polyethers; polyacetals
    • H01B3/421—Polyesters
    • H01B3/426—Polycarbonates
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L67/00—Compositions of polyesters obtained by reactions forming a carboxylic ester link in the main chain; Compositions of derivatives of such polymers
    • C08L67/02—Polyesters derived from dicarboxylic acids and dihydroxy compounds
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L69/00—Compositions of polycarbonates; Compositions of derivatives of polycarbonates
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B3/00—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties
    • H01B3/18—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances
    • H01B3/30—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances plastics; resins; waxes
    • H01B3/42—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances plastics; resins; waxes polyesters; polyethers; polyacetals
    • H01B3/421—Polyesters

Landscapes

  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Physics & Mathematics (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Manufacture Of Macromolecular Shaped Articles (AREA)
JP63122665A 1987-05-20 1988-05-19 Resin composition Pending JPS6454055A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP63122665A JPS6454055A (en) 1987-05-20 1988-05-19 Resin composition

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP12285987 1987-05-20
JP63122665A JPS6454055A (en) 1987-05-20 1988-05-19 Resin composition

Publications (1)

Publication Number Publication Date
JPS6454055A true JPS6454055A (en) 1989-03-01

Family

ID=14846405

Family Applications (1)

Application Number Title Priority Date Filing Date
JP63122665A Pending JPS6454055A (en) 1987-05-20 1988-05-19 Resin composition

Country Status (4)

Country Link
US (1) US4840995A (ja)
JP (1) JPS6454055A (ja)
KR (1) KR880014055A (ja)
DE (1) DE3817155A1 (ja)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7355834B2 (en) 2003-11-28 2008-04-08 Samsung Electronics Co., Ltd. Cover unit of a substrate for an image forming apparatus and method

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4904747A (en) * 1988-12-23 1990-02-27 Eastman Kodak Company Blends of polycarbonates with polyesters from 4,4'-biphenyldicarboxylic acid and 1,6-hexanediol
US5502098A (en) * 1993-06-28 1996-03-26 Cosmo Research Institute Polymer composition for electrical part material
EP0819149A1 (en) * 1995-04-07 1998-01-21 The Dow Chemical Company Blends of polycarbonate and linear ethylene polymers
JP2001506680A (ja) * 1996-11-27 2001-05-22 ザ・ダウ・ケミカル・カンパニー ポリカーボネートブレンド組成物
WO2020212245A1 (de) * 2019-04-18 2020-10-22 Covestro Intellectual Property Gmbh & Co. Kg Wärmeleitfähige polycarbonate mit verbessertem flammschutz durch bariumsulfat

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5792045A (en) * 1980-11-28 1982-06-08 Mitsubishi Chem Ind Ltd Thermoplastic polyester resin composition
DE3234174A1 (de) * 1982-09-15 1984-03-15 Basf Ag, 6700 Ludwigshafen Schlagzaehe thermoplastische formmassen mit hoher waermeformbestaendigkeit
JPS5966448A (ja) * 1982-10-07 1984-04-14 Mitsui Petrochem Ind Ltd 熱可塑性樹脂組成物
US4634737A (en) * 1984-12-19 1987-01-06 General Electric Company Copolyester-carbonate composition

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7355834B2 (en) 2003-11-28 2008-04-08 Samsung Electronics Co., Ltd. Cover unit of a substrate for an image forming apparatus and method

Also Published As

Publication number Publication date
US4840995A (en) 1989-06-20
KR880014055A (ko) 1988-12-22
DE3817155A1 (de) 1988-12-15

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