JPS6453748U - - Google Patents
Info
- Publication number
- JPS6453748U JPS6453748U JP14937687U JP14937687U JPS6453748U JP S6453748 U JPS6453748 U JP S6453748U JP 14937687 U JP14937687 U JP 14937687U JP 14937687 U JP14937687 U JP 14937687U JP S6453748 U JPS6453748 U JP S6453748U
- Authority
- JP
- Japan
- Prior art keywords
- mask
- forming
- weight
- parts
- silicon nitride
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 229910052581 Si3N4 Inorganic materials 0.000 claims 3
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 claims 3
- 239000000919 ceramic Substances 0.000 claims 2
- QIJNJJZPYXGIQM-UHFFFAOYSA-N 1lambda4,2lambda4-dimolybdacyclopropa-1,2,3-triene Chemical compound [Mo]=C=[Mo] QIJNJJZPYXGIQM-UHFFFAOYSA-N 0.000 claims 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims 1
- 229910039444 MoC Inorganic materials 0.000 claims 1
- 239000011248 coating agent Substances 0.000 claims 1
- 238000000576 coating method Methods 0.000 claims 1
- 229910052802 copper Inorganic materials 0.000 claims 1
- 239000010949 copper Substances 0.000 claims 1
- PMHQVHHXPFUNSP-UHFFFAOYSA-M copper(1+);methylsulfanylmethane;bromide Chemical compound Br[Cu].CSC PMHQVHHXPFUNSP-UHFFFAOYSA-M 0.000 claims 1
- 238000007750 plasma spraying Methods 0.000 claims 1
- 230000003746 surface roughness Effects 0.000 claims 1
Landscapes
- Coating By Spraying Or Casting (AREA)
Description
第１図および第２図は本考案のマスクの一実施
例を示し、第１図は正面図、第２図は断面図であ
る。 １……焼結体、２……パターン孔。
例を示し、第１図は正面図、第２図は断面図であ
る。 １……焼結体、２……パターン孔。
Claims (1)
- 【実用新案登録請求の範囲】 (1) 窒化けい素セラミツクスの焼結体で形成さ
れ、表面が平滑に仕上げられてなる被覆パターン
形成用マスク。 (2) 窒化けい素セラミツクスの焼結体は、窒化
けい素１００重量部、イツトリア２〜８重量部、
窒化アルミニウム１〜５重量部、炭化モリブデン
３重量部以下からなるものである実用新案登録請
求の範囲第１項記載の被覆パターン形成用マスク
。 (3) 表面粗さがＲｍａｘ０．２Ｓ以下である実
用新案登録請求の範囲第１項記載の被覆パターン
形成用マスク。 (4) 銅プラズマ溶射に用いるものである実用新
案登録請求の範囲第１項ないし第３項記載の被覆
パターン形成用マスク。
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP14937687U JPS6453748U (ja) | 1987-09-30 | 1987-09-30 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP14937687U JPS6453748U (ja) | 1987-09-30 | 1987-09-30 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6453748U true JPS6453748U (ja) | 1989-04-03 |
Family
ID=31421549
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP14937687U Pending JPS6453748U (ja) | 1987-09-30 | 1987-09-30 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6453748U (ja) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7177007B2 (en) | 2000-04-07 | 2007-02-13 | Canon Kabushiki Kaisha | Temperature adjustment apparatus, exposure apparatus having the temperature adjustment apparatus, and semiconductor device manufacturing method |
| JP2007131948A (ja) * | 2005-11-07 | 2007-05-31 | United Technol Corp <Utc> | コーティング方法及び装置 |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS602662A (ja) * | 1983-06-21 | 1985-01-08 | Agency Of Ind Science & Technol | セラミツクス被覆層の形成方法 |
| JPS62182262A (ja) * | 1986-02-06 | 1987-08-10 | Ishibashi Yoshinobu | 溶射方法 |
-
1987
- 1987-09-30 JP JP14937687U patent/JPS6453748U/ja active Pending
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS602662A (ja) * | 1983-06-21 | 1985-01-08 | Agency Of Ind Science & Technol | セラミツクス被覆層の形成方法 |
| JPS62182262A (ja) * | 1986-02-06 | 1987-08-10 | Ishibashi Yoshinobu | 溶射方法 |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7177007B2 (en) | 2000-04-07 | 2007-02-13 | Canon Kabushiki Kaisha | Temperature adjustment apparatus, exposure apparatus having the temperature adjustment apparatus, and semiconductor device manufacturing method |
| JP2007131948A (ja) * | 2005-11-07 | 2007-05-31 | United Technol Corp <Utc> | コーティング方法及び装置 |
| JP4509085B2 (ja) * | 2005-11-07 | 2010-07-21 | ユナイテッド テクノロジーズ コーポレイション | コーティング方法及び装置 |