JPS6453104A - Instrument and method for inspecting bonding shape - Google Patents

Instrument and method for inspecting bonding shape

Info

Publication number
JPS6453104A
JPS6453104A JP20953887A JP20953887A JPS6453104A JP S6453104 A JPS6453104 A JP S6453104A JP 20953887 A JP20953887 A JP 20953887A JP 20953887 A JP20953887 A JP 20953887A JP S6453104 A JPS6453104 A JP S6453104A
Authority
JP
Japan
Prior art keywords
data
center line
ball
inspection
bonding
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP20953887A
Other languages
Japanese (ja)
Inventor
Hiroyuki Tsukahara
Masahito Nakajima
Tetsuo Hizuka
Takuya Uzumaki
Noriyuki Hiraoka
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fujitsu Ltd
Original Assignee
Fujitsu Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fujitsu Ltd filed Critical Fujitsu Ltd
Priority to JP20953887A priority Critical patent/JPS6453104A/en
Publication of JPS6453104A publication Critical patent/JPS6453104A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
    • H01L2224/859—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector involving monitoring, e.g. feedback loop

Landscapes

  • Length Measuring Devices By Optical Means (AREA)

Abstract

PURPOSE:To improve the inspection accuracy of bonding by segmenting images of a bonding part in a wire track direction, finding ball diameter measurement data based upon the center line of the ball shape, and deciding whether or not the ball shape part is normal. CONSTITUTION:A segmentation position memory 17 is stored previously with data on the position where an inspection window for the bonding shape is segmented at right angles to the wire track direction and image data on the inspection window is segmented from a digital image of an object 11 of inspection stored in an image memory 16 according to the data in the memory 17. Then a center line arithmetic circuit 19 detects the center line of the ball part crossing the wire track direction at right angles from projection data outputted by a segmentation projection circuit 18 and a ball diameter length arithmetic circuit 20 draws a perpendicular from the middle point C of the center line to detect B detain a radius length direction and A data in a diameter length direction; and arithmetic based upon inspection reference is carried out to decide whether or not the bonding shape is normal.
JP20953887A 1987-08-24 1987-08-24 Instrument and method for inspecting bonding shape Pending JPS6453104A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP20953887A JPS6453104A (en) 1987-08-24 1987-08-24 Instrument and method for inspecting bonding shape

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP20953887A JPS6453104A (en) 1987-08-24 1987-08-24 Instrument and method for inspecting bonding shape

Publications (1)

Publication Number Publication Date
JPS6453104A true JPS6453104A (en) 1989-03-01

Family

ID=16574464

Family Applications (1)

Application Number Title Priority Date Filing Date
JP20953887A Pending JPS6453104A (en) 1987-08-24 1987-08-24 Instrument and method for inspecting bonding shape

Country Status (1)

Country Link
JP (1) JPS6453104A (en)

Similar Documents

Publication Publication Date Title
JPS58215541A (en) Automatic optical inspection method
DE69207689D1 (en) Method for testing an electrical wire in the stripped state
JPS63211076A (en) Pattern checking device
JPS6453104A (en) Instrument and method for inspecting bonding shape
JPS57196377A (en) Pattern recognizing method
US4765744A (en) Method for testing a photomask
JPH03216503A (en) Position recognizing instrument
JPS61193007A (en) Inspecting method for rod type projection body
JP2535704Y2 (en) Shading image processing device
JP3106370B2 (en) Defect detection and type recognition of printed circuit boards using graph information
JPS61129512A (en) Inspecting instrument for curvature of lead
JP2969779B2 (en) Shading image processing device
JP2522927Y2 (en) Shading image processing device
JPH01207878A (en) Contour inspection device
JPS60225006A (en) Detecting device of curve of long object
JPS6319793Y2 (en)
JP2557887B2 (en) Vehicle speed measurement device
JPS63289945A (en) Device for inspecting electronic component
JPS63147282A (en) Pattern detecting method
JPS62148838A (en) Defect recognizing method
JPS60196607A (en) Configuration recognizing apparatus
JPH07244796A (en) Vehicle detector
JPS62119442A (en) Pattern inspecting apparatus
JPH05113410A (en) Inspecting apparatus for cream solder printing
JP2768368B2 (en) Pattern inspection equipment