JPS6452269U - - Google Patents
Info
- Publication number
- JPS6452269U JPS6452269U JP14716387U JP14716387U JPS6452269U JP S6452269 U JPS6452269 U JP S6452269U JP 14716387 U JP14716387 U JP 14716387U JP 14716387 U JP14716387 U JP 14716387U JP S6452269 U JPS6452269 U JP S6452269U
- Authority
- JP
- Japan
- Prior art keywords
- circuit board
- capacitor
- pattern
- electrode
- dielectric member
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 230000001681 protective effect Effects 0.000 claims description 6
- 239000003990 capacitor Substances 0.000 claims description 5
- 238000010586 diagram Methods 0.000 description 8
- 238000007796 conventional method Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
Landscapes
- Parts Printed On Printed Circuit Boards (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP14716387U JPS6452269U (is) | 1987-09-26 | 1987-09-26 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP14716387U JPS6452269U (is) | 1987-09-26 | 1987-09-26 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6452269U true JPS6452269U (is) | 1989-03-31 |
Family
ID=31417316
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP14716387U Pending JPS6452269U (is) | 1987-09-26 | 1987-09-26 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6452269U (is) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7038143B2 (en) | 2002-05-16 | 2006-05-02 | Mitsubishi Denki Kabushiki Kaisha | Wiring board, fabrication method of wiring board, and semiconductor device |
| JP2007123940A (ja) * | 2003-06-27 | 2007-05-17 | Tdk Corp | コンデンサを内蔵した基板およびその製造方法 |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5041064A (is) * | 1973-08-15 | 1975-04-15 | ||
| JPS5384175A (en) * | 1976-12-30 | 1978-07-25 | Fujitsu Ltd | Method of producing multilayer printed board |
| JPS6313397A (ja) * | 1986-07-03 | 1988-01-20 | 松下電器産業株式会社 | コンデンサ内蔵厚膜回路基板 |
-
1987
- 1987-09-26 JP JP14716387U patent/JPS6452269U/ja active Pending
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5041064A (is) * | 1973-08-15 | 1975-04-15 | ||
| JPS5384175A (en) * | 1976-12-30 | 1978-07-25 | Fujitsu Ltd | Method of producing multilayer printed board |
| JPS6313397A (ja) * | 1986-07-03 | 1988-01-20 | 松下電器産業株式会社 | コンデンサ内蔵厚膜回路基板 |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7038143B2 (en) | 2002-05-16 | 2006-05-02 | Mitsubishi Denki Kabushiki Kaisha | Wiring board, fabrication method of wiring board, and semiconductor device |
| JP2007123940A (ja) * | 2003-06-27 | 2007-05-17 | Tdk Corp | コンデンサを内蔵した基板およびその製造方法 |