JPS6452239U - - Google Patents
Info
- Publication number
- JPS6452239U JPS6452239U JP14704687U JP14704687U JPS6452239U JP S6452239 U JPS6452239 U JP S6452239U JP 14704687 U JP14704687 U JP 14704687U JP 14704687 U JP14704687 U JP 14704687U JP S6452239 U JPS6452239 U JP S6452239U
- Authority
- JP
- Japan
- Prior art keywords
- resin
- mold
- cylinder rod
- injection
- rod
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000002347 injection Methods 0.000 claims description 4
- 239000007924 injection Substances 0.000 claims description 4
- 239000011347 resin Substances 0.000 claims 3
- 229920005989 resin Polymers 0.000 claims 3
- 238000000465 moulding Methods 0.000 claims 2
- 238000007789 sealing Methods 0.000 claims 1
- 239000004065 semiconductor Substances 0.000 claims 1
Landscapes
- Moulds For Moulding Plastics Or The Like (AREA)
- Injection Moulding Of Plastics Or The Like (AREA)
- Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
Description
第１図はこの考案の一実施例を示す断面図、第
２図はその底面図、第３図は第１図の平面図、第
４図はその部分断面側面図、第５図は従来装置の
部分断面図、第６図はその底面図である。
図において、１は射出シリンダロツド、２は金
型、３は馬締形フランジ、４はシリンダロツド、
５はプレス、６は六角穴付ボルト、７はストツパ
、８はフランジである。尚、各図中同一符号は同
一又は相当部分を示す。
Fig. 1 is a sectional view showing an embodiment of this invention, Fig. 2 is a bottom view thereof, Fig. 3 is a plan view of Fig. 1, Fig. 4 is a partially sectional side view thereof, and Fig. 5 is a conventional device. FIG. 6 is a bottom view. In the figure, 1 is an injection cylinder rod, 2 is a mold, 3 is a horse-clamped flange, 4 is a cylinder rod,
5 is a press, 6 is a hexagon socket head bolt, 7 is a stopper, and 8 is a flange. Note that the same reference numerals in each figure indicate the same or corresponding parts.
Claims (1)
ーブルを備えたプレス上に設置され機能する樹脂
封止成形用モールド金型において、上記射出シリ
ンダロツドとワンタツチ接続可能な馬締形部材と
下端にＩ形切欠きを持つシリンダロツド、このロ
ツドに取つけられるプランジヤヘツド、樹脂を投
入するポツトとを備えたことを特徴とする樹脂封
止形半導体装置成形用モールド金型。 A mold for resin sealing molding is installed and functions on a press equipped with an injection cylinder for resin injection and a slide table for mold clamping, and includes a horse clamp-shaped member that can be connected to the injection cylinder rod in one touch, and an I-shaped notch at the lower end. A mold for molding a resin-sealed semiconductor device, comprising a cylinder rod having a cylinder rod, a plunger head attached to the rod, and a pot for charging resin.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP14704687U JPS6452239U (en) | 1987-09-25 | 1987-09-25 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP14704687U JPS6452239U (en) | 1987-09-25 | 1987-09-25 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6452239U true JPS6452239U (en) | 1989-03-31 |
Family
ID=31417094
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP14704687U Pending JPS6452239U (en) | 1987-09-25 | 1987-09-25 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6452239U (en) |
-
1987
- 1987-09-25 JP JP14704687U patent/JPS6452239U/ja active Pending
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