JPS6451422A - Curable resin composition - Google Patents
Curable resin compositionInfo
- Publication number
- JPS6451422A JPS6451422A JP62208485A JP20848587A JPS6451422A JP S6451422 A JPS6451422 A JP S6451422A JP 62208485 A JP62208485 A JP 62208485A JP 20848587 A JP20848587 A JP 20848587A JP S6451422 A JPS6451422 A JP S6451422A
- Authority
- JP
- Japan
- Prior art keywords
- group
- compound
- mxn
- photopolymerization
- halogen
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Polyurethanes Or Polyureas (AREA)
Abstract
PURPOSE:To obtain the title composition excellent in adhesiveness, flexibility, oil resistance, etc., by mixing an at least bifunctional isocyanate compound with an at least dihydric polyalcohol compound and a photopolymerization/ cationic polymerization catalyst. CONSTITUTION:A mixture formed by mixing an at least bifunctional isocyanate compound (A) (e.g., tetramethylene diisocyanate) with an at least dihydric alcohol compound (B) (e.g., polyethylene adipate) in such amounts that the ratio of the number of the isocyanate groups to the number of the hydroxyl groups is 0.1-20 is mixed with 0.01-10pts.wt. photopolymerization/cationic polymerization catalyst of any one of formulas I-V (wherein MXn is a complex ion, X is a halogen such as F or Cl, M is a transition metal such as Sb, Fe or Sn, or a semimetal such as B or P, Y is a substituent such as nitro, hydroxyl, halogen or N-morpholino, m varies with the valence of MXn, Q<1> is a Group VIa element such as S or a Group IVa element such as Si or Sn, Q<2> is a Group Va element such as P or N, Q<3> is a transition metal such as Fe, and R is an aromatic group or an aliphatic group).
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP62208485A JPS6451422A (en) | 1987-08-21 | 1987-08-21 | Curable resin composition |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP62208485A JPS6451422A (en) | 1987-08-21 | 1987-08-21 | Curable resin composition |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS6451422A true JPS6451422A (en) | 1989-02-27 |
Family
ID=16556941
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP62208485A Pending JPS6451422A (en) | 1987-08-21 | 1987-08-21 | Curable resin composition |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS6451422A (en) |
Cited By (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS6470515A (en) * | 1987-08-28 | 1989-03-16 | Minnesota Mining & Mfg | Energy polymeric composition containing polyurethane precursor |
JP2000071392A (en) * | 1998-09-01 | 2000-03-07 | Toppan Printing Co Ltd | Hard coat film or sheet |
JP2003026753A (en) * | 2001-07-18 | 2003-01-29 | Mitsubishi Gas Chem Co Inc | Method for manufacturing resin |
JP2008094105A (en) * | 2007-11-29 | 2008-04-24 | Toppan Printing Co Ltd | Hardcoat film or sheet |
JP2010192900A (en) * | 2009-02-19 | 2010-09-02 | General Electric Co <Ge> | Chip attach adhesive to facilitate embedded chip build up, and related system and method |
-
1987
- 1987-08-21 JP JP62208485A patent/JPS6451422A/en active Pending
Cited By (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS6470515A (en) * | 1987-08-28 | 1989-03-16 | Minnesota Mining & Mfg | Energy polymeric composition containing polyurethane precursor |
JP2000071392A (en) * | 1998-09-01 | 2000-03-07 | Toppan Printing Co Ltd | Hard coat film or sheet |
JP2003026753A (en) * | 2001-07-18 | 2003-01-29 | Mitsubishi Gas Chem Co Inc | Method for manufacturing resin |
JP2008094105A (en) * | 2007-11-29 | 2008-04-24 | Toppan Printing Co Ltd | Hardcoat film or sheet |
JP2010192900A (en) * | 2009-02-19 | 2010-09-02 | General Electric Co <Ge> | Chip attach adhesive to facilitate embedded chip build up, and related system and method |
US8604612B2 (en) | 2009-02-19 | 2013-12-10 | General Electric Company | Chip attach adhesive to facilitate embedded chip build up and related systems and methods |
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