JPS6450467U - - Google Patents
Info
- Publication number
- JPS6450467U JPS6450467U JP14603187U JP14603187U JPS6450467U JP S6450467 U JPS6450467 U JP S6450467U JP 14603187 U JP14603187 U JP 14603187U JP 14603187 U JP14603187 U JP 14603187U JP S6450467 U JPS6450467 U JP S6450467U
- Authority
- JP
- Japan
- Prior art keywords
- insulating substrate
- conductor layer
- resistor
- layer
- integrated circuit
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000758 substrate Substances 0.000 claims description 6
- 239000004020 conductor Substances 0.000 claims description 5
- 239000003990 capacitor Substances 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
- H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
- H01L2224/161—Disposition
- H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
- H01L2224/732—Location after the connecting process
- H01L2224/73251—Location after the connecting process on different surfaces
- H01L2224/73265—Layer and wire connectors
Landscapes
- Parts Printed On Printed Circuit Boards (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP14603187U JPS6450467U (tr) | 1987-09-24 | 1987-09-24 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP14603187U JPS6450467U (tr) | 1987-09-24 | 1987-09-24 |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS6450467U true JPS6450467U (tr) | 1989-03-29 |
Family
ID=31415149
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP14603187U Pending JPS6450467U (tr) | 1987-09-24 | 1987-09-24 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS6450467U (tr) |
Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS4956167A (tr) * | 1972-09-29 | 1974-05-31 | ||
JPS51147763A (en) * | 1975-06-14 | 1976-12-18 | Fujitsu Ltd | Method of making resistors and capacitors |
JPS55130194A (en) * | 1979-03-30 | 1980-10-08 | Matsushita Electric Ind Co Ltd | Printed resistance board and method of fabricating same |
-
1987
- 1987-09-24 JP JP14603187U patent/JPS6450467U/ja active Pending
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS4956167A (tr) * | 1972-09-29 | 1974-05-31 | ||
JPS51147763A (en) * | 1975-06-14 | 1976-12-18 | Fujitsu Ltd | Method of making resistors and capacitors |
JPS55130194A (en) * | 1979-03-30 | 1980-10-08 | Matsushita Electric Ind Co Ltd | Printed resistance board and method of fabricating same |