JPS6450453U - - Google Patents
Info
- Publication number
- JPS6450453U JPS6450453U JP1987145706U JP14570687U JPS6450453U JP S6450453 U JPS6450453 U JP S6450453U JP 1987145706 U JP1987145706 U JP 1987145706U JP 14570687 U JP14570687 U JP 14570687U JP S6450453 U JPS6450453 U JP S6450453U
- Authority
- JP
- Japan
- Prior art keywords
- image sensor
- film
- silicone resin
- ccd chip
- protective film
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/01—Manufacture or treatment
- H10W72/015—Manufacture or treatment of bond wires
- H10W72/01515—Forming coatings
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/071—Connecting or disconnecting
- H10W72/075—Connecting or disconnecting of bond wires
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W90/00—Package configurations
- H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
- H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
- H10W90/754—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked insulating package substrate, interposer or RDL
Landscapes
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
- Solid State Image Pick-Up Elements (AREA)
- Transforming Light Signals Into Electric Signals (AREA)
- Facsimile Heads (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1987145706U JPS6450453U (enFirst) | 1987-09-24 | 1987-09-24 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1987145706U JPS6450453U (enFirst) | 1987-09-24 | 1987-09-24 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6450453U true JPS6450453U (enFirst) | 1989-03-29 |
Family
ID=31414531
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1987145706U Pending JPS6450453U (enFirst) | 1987-09-24 | 1987-09-24 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6450453U (enFirst) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2019009171A (ja) * | 2017-06-21 | 2019-01-17 | スタンレー電気株式会社 | 半導体装置 |
-
1987
- 1987-09-24 JP JP1987145706U patent/JPS6450453U/ja active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2019009171A (ja) * | 2017-06-21 | 2019-01-17 | スタンレー電気株式会社 | 半導体装置 |