JPS6450445U - - Google Patents
Info
- Publication number
- JPS6450445U JPS6450445U JP14604187U JP14604187U JPS6450445U JP S6450445 U JPS6450445 U JP S6450445U JP 14604187 U JP14604187 U JP 14604187U JP 14604187 U JP14604187 U JP 14604187U JP S6450445 U JPS6450445 U JP S6450445U
- Authority
- JP
- Japan
- Prior art keywords
- lengths
- flat
- flat package
- terminals
- circuit board
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000005452 bending Methods 0.000 claims 1
- 239000003973 paint Substances 0.000 description 1
Landscapes
- Lead Frames For Integrated Circuits (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP14604187U JPS6450445U (sl) | 1987-09-24 | 1987-09-24 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP14604187U JPS6450445U (sl) | 1987-09-24 | 1987-09-24 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6450445U true JPS6450445U (sl) | 1989-03-29 |
Family
ID=31415168
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP14604187U Pending JPS6450445U (sl) | 1987-09-24 | 1987-09-24 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6450445U (sl) |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS4942426U (sl) * | 1972-07-19 | 1974-04-13 | ||
| JPS52156564A (en) * | 1976-06-22 | 1977-12-27 | Nec Corp | Semiconductor package |
-
1987
- 1987-09-24 JP JP14604187U patent/JPS6450445U/ja active Pending
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS4942426U (sl) * | 1972-07-19 | 1974-04-13 | ||
| JPS52156564A (en) * | 1976-06-22 | 1977-12-27 | Nec Corp | Semiconductor package |