JPS6450436U - - Google Patents

Info

Publication number
JPS6450436U
JPS6450436U JP1987144601U JP14460187U JPS6450436U JP S6450436 U JPS6450436 U JP S6450436U JP 1987144601 U JP1987144601 U JP 1987144601U JP 14460187 U JP14460187 U JP 14460187U JP S6450436 U JPS6450436 U JP S6450436U
Authority
JP
Japan
Prior art keywords
integrated circuit
chip
cavity
bonding pads
wire bonding
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1987144601U
Other languages
English (en)
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1987144601U priority Critical patent/JPS6450436U/ja
Publication of JPS6450436U publication Critical patent/JPS6450436U/ja
Pending legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10WGENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00Interconnections or connectors in packages
    • H10W72/50Bond wires
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10WGENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00Interconnections or connectors in packages
    • H10W72/071Connecting or disconnecting
    • H10W72/075Connecting or disconnecting of bond wires
    • H10W72/07541Controlling the environment, e.g. atmosphere composition or temperature
    • H10W72/07551Controlling the environment, e.g. atmosphere composition or temperature characterised by changes in properties of the bond wires during the connecting
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10WGENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00Interconnections or connectors in packages
    • H10W72/50Bond wires
    • H10W72/541Dispositions of bond wires
    • H10W72/5449Dispositions of bond wires not being orthogonal to a side surface of the chip, e.g. fan-out arrangements

Landscapes

  • Wire Bonding (AREA)
  • Lead Frames For Integrated Circuits (AREA)
JP1987144601U 1987-09-22 1987-09-22 Pending JPS6450436U (enFirst)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1987144601U JPS6450436U (enFirst) 1987-09-22 1987-09-22

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1987144601U JPS6450436U (enFirst) 1987-09-22 1987-09-22

Publications (1)

Publication Number Publication Date
JPS6450436U true JPS6450436U (enFirst) 1989-03-29

Family

ID=31412450

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1987144601U Pending JPS6450436U (enFirst) 1987-09-22 1987-09-22

Country Status (1)

Country Link
JP (1) JPS6450436U (enFirst)

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