JPS645021A - Bonding equipment for manufacture of semiconductor parts - Google Patents

Bonding equipment for manufacture of semiconductor parts

Info

Publication number
JPS645021A
JPS645021A JP62159819A JP15981987A JPS645021A JP S645021 A JPS645021 A JP S645021A JP 62159819 A JP62159819 A JP 62159819A JP 15981987 A JP15981987 A JP 15981987A JP S645021 A JPS645021 A JP S645021A
Authority
JP
Japan
Prior art keywords
equipment
card
feeder
bonding
manufacture
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP62159819A
Other languages
Japanese (ja)
Other versions
JP2649805B2 (en
Inventor
Shuichi Shimada
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toshiba Mechatronics Co Ltd
Original Assignee
Toshiba Seiki Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toshiba Seiki Co Ltd filed Critical Toshiba Seiki Co Ltd
Priority to JP62159819A priority Critical patent/JP2649805B2/en
Publication of JPS645021A publication Critical patent/JPS645021A/en
Application granted granted Critical
Publication of JP2649805B2 publication Critical patent/JP2649805B2/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
    • H01L24/78—Apparatus for connecting with wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/78—Apparatus for connecting with wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Credit Cards Or The Like (AREA)
  • Wire Bonding (AREA)
  • Die Bonding (AREA)

Abstract

PURPOSE:To operate and manage a bonding equipment, by connecting an IC card containing an IC memory to a control equipment via an IC card connecting part, and performing input and output of data between the IC memory and the control equipment. CONSTITUTION:An IC card 32 containing a RAM 33 is connected to a main control equipment 23 via a read-write equipment 30. Between the RAN 33 of the card 32 and the equipment 23, input and output of data are performed. A CPU 27 of the equipment 23 drives and controls each motor 16, 17, 18 via an XYZ controlling part 24 in the manner in which a bonding tool operates according to a pattern stored on the card 32. The CPU 27 drives and controls a feeder motor 22 via a feeder controlling part 25 in the manner in which a feeder operates with a pitch stored on the card 32 and a specified timing. Thereby, a bonding equipment is operated and managed.
JP62159819A 1987-06-29 1987-06-29 Bonding equipment for semiconductor component manufacturing Expired - Fee Related JP2649805B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP62159819A JP2649805B2 (en) 1987-06-29 1987-06-29 Bonding equipment for semiconductor component manufacturing

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP62159819A JP2649805B2 (en) 1987-06-29 1987-06-29 Bonding equipment for semiconductor component manufacturing

Publications (2)

Publication Number Publication Date
JPS645021A true JPS645021A (en) 1989-01-10
JP2649805B2 JP2649805B2 (en) 1997-09-03

Family

ID=15701942

Family Applications (1)

Application Number Title Priority Date Filing Date
JP62159819A Expired - Fee Related JP2649805B2 (en) 1987-06-29 1987-06-29 Bonding equipment for semiconductor component manufacturing

Country Status (1)

Country Link
JP (1) JP2649805B2 (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH03173443A (en) * 1989-12-01 1991-07-26 Toshiba Seiki Kk Bonding device
JP2009004808A (en) * 2008-09-16 2009-01-08 Hitachi Kokusai Electric Inc Method of production information data analysis for semiconductor manufacturing apparatus, and apparatus for manufacturing semiconductor device

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS61168928A (en) * 1985-01-22 1986-07-30 Toshiba Corp Bonding apparatus

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS61168928A (en) * 1985-01-22 1986-07-30 Toshiba Corp Bonding apparatus

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH03173443A (en) * 1989-12-01 1991-07-26 Toshiba Seiki Kk Bonding device
JP2009004808A (en) * 2008-09-16 2009-01-08 Hitachi Kokusai Electric Inc Method of production information data analysis for semiconductor manufacturing apparatus, and apparatus for manufacturing semiconductor device

Also Published As

Publication number Publication date
JP2649805B2 (en) 1997-09-03

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Legal Events

Date Code Title Description
R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

LAPS Cancellation because of no payment of annual fees