JPS6448803A - Photosensitive resin composition - Google Patents

Photosensitive resin composition

Info

Publication number
JPS6448803A
JPS6448803A JP20608487A JP20608487A JPS6448803A JP S6448803 A JPS6448803 A JP S6448803A JP 20608487 A JP20608487 A JP 20608487A JP 20608487 A JP20608487 A JP 20608487A JP S6448803 A JPS6448803 A JP S6448803A
Authority
JP
Japan
Prior art keywords
acridyl
group
photosensitive resin
photopolymn
contg
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP20608487A
Other languages
Japanese (ja)
Other versions
JP2570758B2 (en
Inventor
Yoshitaka Minami
Hajime Kakumaru
Taku Kawaguchi
Yumiko Tanaka
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Showa Denko Materials Co Ltd
Original Assignee
Hitachi Chemical Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Chemical Co Ltd filed Critical Hitachi Chemical Co Ltd
Priority to JP62206084A priority Critical patent/JP2570758B2/en
Publication of JPS6448803A publication Critical patent/JPS6448803A/en
Application granted granted Critical
Publication of JP2570758B2 publication Critical patent/JP2570758B2/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
    • G03F7/028—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with photosensitivity-increasing substances, e.g. photoinitiators
    • G03F7/031—Organic compounds not covered by group G03F7/029

Landscapes

  • Physics & Mathematics (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • General Physics & Mathematics (AREA)
  • Polymerisation Methods In General (AREA)

Abstract

PURPOSE:To obtain the title compsn. comprising a specified acridyl side group- contg. photopolymn. initiator, a thermoplastic org. polymer and an ethylene- terminated photopolymerizable compd. and being highly photosensitive and free from solder melting after etching. CONSTITUTION:The title product is a photosensitive resin compsn. contg. a photopolymn. initiator A having a wt.-average MW of at least 320 and having an acridyl side group of the formula as shown [where R1-R8 are each H, a halogen, 1-8C alkyl or methoxy; X is a (substd.)arom. ring conjugated with an acridyl group] [e.g., 9-(p-n-hexylphenyl)acridine, etc.], and a photopolymerizable compd. C having at least one terminal ethylene group (e.g., trimethyloylpropane triacrylate, etc.). This comps. is highly photosensitive and is free from solder melting after etching, so that it can be used in forming a precision circuit.
JP62206084A 1987-08-19 1987-08-19 Photosensitive resin composition Expired - Fee Related JP2570758B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP62206084A JP2570758B2 (en) 1987-08-19 1987-08-19 Photosensitive resin composition

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP62206084A JP2570758B2 (en) 1987-08-19 1987-08-19 Photosensitive resin composition

Publications (2)

Publication Number Publication Date
JPS6448803A true JPS6448803A (en) 1989-02-23
JP2570758B2 JP2570758B2 (en) 1997-01-16

Family

ID=16517554

Family Applications (1)

Application Number Title Priority Date Filing Date
JP62206084A Expired - Fee Related JP2570758B2 (en) 1987-08-19 1987-08-19 Photosensitive resin composition

Country Status (1)

Country Link
JP (1) JP2570758B2 (en)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH02226148A (en) * 1988-12-22 1990-09-07 Hoechst Ag Photopolymerizing mixture and photopolymerizing copying material containing the same
JPH03168749A (en) * 1989-11-29 1991-07-22 Hitachi Chem Co Ltd Photopolymerizable composition and photopolymerizable element
EP0503076A1 (en) * 1990-09-28 1992-09-16 Hitachi Chemical Co., Ltd. Photopolymerizable composition and photopolymerizable element
CN102341753A (en) * 2009-03-13 2012-02-01 日立化成工业株式会社 Photosensitive resin composition, and photosensitive element, resist pattern formation method and printed circuit board production method each utilizing same

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS63256602A (en) * 1987-04-14 1988-10-24 Hitachi Chem Co Ltd Photopolymerizable composition

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS63256602A (en) * 1987-04-14 1988-10-24 Hitachi Chem Co Ltd Photopolymerizable composition

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH02226148A (en) * 1988-12-22 1990-09-07 Hoechst Ag Photopolymerizing mixture and photopolymerizing copying material containing the same
JPH03168749A (en) * 1989-11-29 1991-07-22 Hitachi Chem Co Ltd Photopolymerizable composition and photopolymerizable element
EP0503076A1 (en) * 1990-09-28 1992-09-16 Hitachi Chemical Co., Ltd. Photopolymerizable composition and photopolymerizable element
EP0503076A4 (en) * 1990-09-28 1993-02-24 Hitachi Chemical Co., Ltd. Photopolymerizable composition and photopolymerizable element
CN102341753A (en) * 2009-03-13 2012-02-01 日立化成工业株式会社 Photosensitive resin composition, and photosensitive element, resist pattern formation method and printed circuit board production method each utilizing same
JP5344034B2 (en) * 2009-03-13 2013-11-20 日立化成株式会社 Photosensitive resin composition, photosensitive element using the same, resist pattern forming method, and printed wiring board manufacturing method

Also Published As

Publication number Publication date
JP2570758B2 (en) 1997-01-16

Similar Documents

Publication Publication Date Title
DE69133558D1 (en) Semiconductor chip assembly and method for its manufacture
GB2211629B (en) Process for the stripping of post baked photoresist from substrates.
EP0259037A3 (en) Absorbent resin
EP0096459A3 (en) Polymerisation process
JPS6448803A (en) Photosensitive resin composition
AU557175B2 (en) 2,6-dimethyl-4-(3-nitro phenyl)-1,4-dihydro pyridine-3,5- dicarboxylic acid esters
AU7909887A (en) Stripping compositions and methods of stripping resists from substrates
JPS5651735A (en) Photoreactive composition
AU7988187A (en) An integrated ringing circuit and a ring trip circuit for the same
EP0503076A4 (en) Photopolymerizable composition and photopolymerizable element
MY121340A (en) Method and solution for immediate termination of radical polymerisation
JPS51117750A (en) Polycarbonate resin compositions
CA2007771A1 (en) Ocular lens material
EP0366333A3 (en) Solder mask resins having improved stability
JPS5310648A (en) Photosensitive resin compositions
EP0326315A3 (en) Photoresist compositions based on hydroxystyrene copolymers
EP0238963A3 (en) Circuit breaker
Peschanskaya On the Jump-Like Character of the Creep of Solid Amorphous Polymers
JPS5356232A (en) Latex-type adhesive compositions
EP0326314A3 (en) Photoresist compositions based on acetoxystyrene copolymers
JPS5348465A (en) Connecting method of lead frame utilizing through-holes
JPS52113170A (en) Spicemen carrier for ic
JPS6461746A (en) Heat-resisting photosensitive polymer composition
ES2006071A6 (en) Cladding of substrates with thick metal circuit patterns
JPS5227597A (en) High molecular piezo-electric component

Legal Events

Date Code Title Description
LAPS Cancellation because of no payment of annual fees