JPS6448331A - Terminal member - Google Patents

Terminal member

Info

Publication number
JPS6448331A
JPS6448331A JP20546887A JP20546887A JPS6448331A JP S6448331 A JPS6448331 A JP S6448331A JP 20546887 A JP20546887 A JP 20546887A JP 20546887 A JP20546887 A JP 20546887A JP S6448331 A JPS6448331 A JP S6448331A
Authority
JP
Japan
Prior art keywords
plated
layer
gold
extremely thin
nickel
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP20546887A
Other languages
Japanese (ja)
Inventor
Tomio Taniguchi
Katsu Matsuda
Sadamu Nishimura
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Omron Corp
Original Assignee
Omron Tateisi Electronics Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Omron Tateisi Electronics Co filed Critical Omron Tateisi Electronics Co
Priority to JP20546887A priority Critical patent/JPS6448331A/en
Publication of JPS6448331A publication Critical patent/JPS6448331A/en
Pending legal-status Critical Current

Links

Abstract

PURPOSE:To maintain a highly anticorrosive conductive film with an extremely thin gold plating layer by a method wherein nickel is plated as a ground layer for a conductive film; over the ground layer, tin and nickel alloy is plated thinner than the ground layer; gold is plated extremely thin as a finishing layer. CONSTITUTION:Nickel 15 is plated over a base metal 14 as a ground layer; tin and nickel alloy 16 is plated over the ground layer thinner than it as an intermediate layer; in the last step gold 17 is plated extremely thin as a finishing layer to form a conductive film 18. Because of the intermediate layer of tin and nickel alloy 16, even if gold 17 is plated extremely thin for gold saving, corrosive factors which are going to penetrate into the inside through a pin hole of the gold 17 plated layer are shut off, which protects the nickel 15 plated inside layer and improves corrosion resistivity and abrasion resistivity. It is therefore possible to maintain a conductive film of high quality and high contact reliability even if cost cut is made by an extremely thin gold plating.
JP20546887A 1987-08-18 1987-08-18 Terminal member Pending JPS6448331A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP20546887A JPS6448331A (en) 1987-08-18 1987-08-18 Terminal member

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP20546887A JPS6448331A (en) 1987-08-18 1987-08-18 Terminal member

Publications (1)

Publication Number Publication Date
JPS6448331A true JPS6448331A (en) 1989-02-22

Family

ID=16507362

Family Applications (1)

Application Number Title Priority Date Filing Date
JP20546887A Pending JPS6448331A (en) 1987-08-18 1987-08-18 Terminal member

Country Status (1)

Country Link
JP (1) JPS6448331A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH06200395A (en) * 1992-12-28 1994-07-19 Hakko Denki Seisakusho:Kk Contact for gold-plated connector
JPH0773769A (en) * 1993-09-03 1995-03-17 Ngk Spark Plug Co Ltd External connecting terminal for semi-conductor package and manufacture thereof

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH06200395A (en) * 1992-12-28 1994-07-19 Hakko Denki Seisakusho:Kk Contact for gold-plated connector
JPH0773769A (en) * 1993-09-03 1995-03-17 Ngk Spark Plug Co Ltd External connecting terminal for semi-conductor package and manufacture thereof

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