JPS6448212U - - Google Patents
Info
- Publication number
- JPS6448212U JPS6448212U JP14393687U JP14393687U JPS6448212U JP S6448212 U JPS6448212 U JP S6448212U JP 14393687 U JP14393687 U JP 14393687U JP 14393687 U JP14393687 U JP 14393687U JP S6448212 U JPS6448212 U JP S6448212U
- Authority
- JP
- Japan
- Prior art keywords
- mold
- bundle
- striatal
- coating layer
- molds
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000011247 coating layer Substances 0.000 claims description 4
- 239000011347 resin Substances 0.000 claims description 4
- 229920005989 resin Polymers 0.000 claims description 4
- NJPPVKZQTLUDBO-UHFFFAOYSA-N novaluron Chemical compound C1=C(Cl)C(OC(F)(F)C(OC(F)(F)F)F)=CC=C1NC(=O)NC(=O)C1=C(F)C=CC=C1F NJPPVKZQTLUDBO-UHFFFAOYSA-N 0.000 claims description 2
- 238000000926 separation method Methods 0.000 claims 1
- 238000010586 diagram Methods 0.000 description 3
- 239000010410 layer Substances 0.000 description 1
Landscapes
- Moulds For Moulding Plastics Or The Like (AREA)
- Casting Or Compression Moulding Of Plastics Or The Like (AREA)
Description
第１図は本考案の１実施列を示す金型の図で、
ａは上型、ｂは下型の斜視図、第２図は第１図の
金型の使用状態を示す図で、ａは上型、ｂは下型
の斜視図、第３図ａは第１図の上下の金型に樹脂
を充填し密閉した状態をしめす斜視図、ｂは線条
体束に被覆層が形成された状態を示す斜視図、第
４図ａは第３図ｂのＡ−Ａ線からの断面図、ｂは
同じくＢ−Ｂ線からの断面図、第５図は従来の金
型の図でａは上型、ｂは下型の斜視図、第６図は
第５図の金型の使用状態を示す図で、ａは上型、
ｂは下型の斜視図、第７図ａは第５図の上下の金
型に樹脂を充填し密閉した状態をしめす斜視図、
ｂは線条体束に被覆層が形成された状態を示す斜
視図である。
１……金型の上型、１ａ……上型底面、２……
金型の下型、２′……キヤビテイ、２ａ……下型
底面、３……突起部材、４……台座、５……線条
体束、６……樹脂、７……被覆層。
Figure 1 is a diagram of a mold showing one implementation row of the present invention.
a is a perspective view of the upper mold, b is a perspective view of the lower mold, FIG. 2 is a diagram showing the usage state of the mold shown in FIG. Fig. 1 is a perspective view showing a state in which the upper and lower molds are filled with resin and sealed; Fig. 4b is a perspective view showing a state in which a coating layer is formed on the striatal bundle; Fig. 4a is A in Fig. 3b. - A cross-sectional view taken from line A, b is a cross-sectional view taken from line B-B, and FIG. This is a diagram showing the usage state of the mold shown in the figure, a is the upper mold,
b is a perspective view of the lower mold; FIG. 7a is a perspective view showing the upper and lower molds in FIG. 5 filled with resin and sealed;
b is a perspective view showing a state in which a covering layer is formed on the striatal bundle. 1... Upper mold of the mold, 1a... Bottom of the upper mold, 2...
Lower mold of the mold, 2'...Cavity, 2a...Bottom surface of the lower mold, 3...Protrusion member, 4...Pedestal, 5...Striatal body bundle, 6...Resin, 7...Coating layer.
Claims (1)
二つの金型によつて形成されるキヤビテイに樹脂
を充填し、線条体束に被覆層を形成する金型にお
いて、上記金型の内壁に線条体束を分割する突起
部材と、線条体と金型の内壁の間に間隙を設ける
ための台座とを金型の接離方向に沿つて立設した
ことを特徴とする線条体束に被覆層を形成する金
型の構造。 A part of the striatal bundle is held between two molds, a cavity formed by the two molds is filled with resin, and a coating layer is formed on the striatal bundle. A feature is that a protruding member for dividing the filament bundle into the inner wall of the mold, and a pedestal for creating a gap between the filament and the inner wall of the mold are erected along the direction of approach and separation of the mold. The structure of the mold that forms a coating layer on the striatal bundle.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP14393687U JPH0356331Y2 (en) | 1987-09-22 | 1987-09-22 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP14393687U JPH0356331Y2 (en) | 1987-09-22 | 1987-09-22 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS6448212U true JPS6448212U (en) | 1989-03-24 |
| JPH0356331Y2 JPH0356331Y2 (en) | 1991-12-18 |
Family
ID=31411203
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP14393687U Expired JPH0356331Y2 (en) | 1987-09-22 | 1987-09-22 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0356331Y2 (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH1177687A (en) * | 1997-09-10 | 1999-03-23 | Fuji Electric Co Ltd | Resin molding mold electronic part and its production |
| JP2021132048A (en) * | 2016-05-09 | 2021-09-09 | ヤザキ・システムズ・テクノロジーズ・ゲーエムベーハー | Method for manufacturing wiring harness |
-
1987
- 1987-09-22 JP JP14393687U patent/JPH0356331Y2/ja not_active Expired
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH1177687A (en) * | 1997-09-10 | 1999-03-23 | Fuji Electric Co Ltd | Resin molding mold electronic part and its production |
| JP2021132048A (en) * | 2016-05-09 | 2021-09-09 | ヤザキ・システムズ・テクノロジーズ・ゲーエムベーハー | Method for manufacturing wiring harness |
| US11745675B2 (en) | 2016-05-09 | 2023-09-05 | Yazaki Systems Technologies Gmbh | Wiring harness, vehicle component, mold, mold system and method for manufacturing the wiring harness |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0356331Y2 (en) | 1991-12-18 |