JPS6448060U - - Google Patents
Info
- Publication number
- JPS6448060U JPS6448060U JP1987143406U JP14340687U JPS6448060U JP S6448060 U JPS6448060 U JP S6448060U JP 1987143406 U JP1987143406 U JP 1987143406U JP 14340687 U JP14340687 U JP 14340687U JP S6448060 U JPS6448060 U JP S6448060U
- Authority
- JP
- Japan
- Prior art keywords
- light
- emitting diode
- lamp body
- lamp
- lead frame
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000011347 resin Substances 0.000 claims 1
- 229920005989 resin Polymers 0.000 claims 1
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48135—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip
- H01L2224/48137—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip the bodies being arranged next to each other, e.g. on a common substrate
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1987143406U JPS6448060U (US20020193084A1-20021219-M00002.png) | 1987-09-18 | 1987-09-18 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1987143406U JPS6448060U (US20020193084A1-20021219-M00002.png) | 1987-09-18 | 1987-09-18 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6448060U true JPS6448060U (US20020193084A1-20021219-M00002.png) | 1989-03-24 |
Family
ID=31410202
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1987143406U Pending JPS6448060U (US20020193084A1-20021219-M00002.png) | 1987-09-18 | 1987-09-18 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6448060U (US20020193084A1-20021219-M00002.png) |
-
1987
- 1987-09-18 JP JP1987143406U patent/JPS6448060U/ja active Pending
