JPS6448027U - - Google Patents

Info

Publication number
JPS6448027U
JPS6448027U JP1987143418U JP14341887U JPS6448027U JP S6448027 U JPS6448027 U JP S6448027U JP 1987143418 U JP1987143418 U JP 1987143418U JP 14341887 U JP14341887 U JP 14341887U JP S6448027 U JPS6448027 U JP S6448027U
Authority
JP
Japan
Prior art keywords
back electrode
metal plate
semiconductor device
fixed
main surface
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1987143418U
Other languages
English (en)
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1987143418U priority Critical patent/JPS6448027U/ja
Publication of JPS6448027U publication Critical patent/JPS6448027U/ja
Pending legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/26Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L24/31Structure, shape, material or disposition of the layer connectors after the connecting process
    • H01L24/32Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/26Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L2224/2612Auxiliary members for layer connectors, e.g. spacers
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10Details of semiconductor or other solid state devices to be connected
    • H01L2924/1015Shape
    • H01L2924/10155Shape being other than a cuboid
    • H01L2924/10157Shape being other than a cuboid at the active surface
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10Details of semiconductor or other solid state devices to be connected
    • H01L2924/1015Shape
    • H01L2924/10155Shape being other than a cuboid
    • H01L2924/10158Shape being other than a cuboid at the passive surface

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Thyristors (AREA)
  • Die Bonding (AREA)
JP1987143418U 1987-09-18 1987-09-18 Pending JPS6448027U (US20020193084A1-20021219-M00002.png)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1987143418U JPS6448027U (US20020193084A1-20021219-M00002.png) 1987-09-18 1987-09-18

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1987143418U JPS6448027U (US20020193084A1-20021219-M00002.png) 1987-09-18 1987-09-18

Publications (1)

Publication Number Publication Date
JPS6448027U true JPS6448027U (US20020193084A1-20021219-M00002.png) 1989-03-24

Family

ID=31410226

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1987143418U Pending JPS6448027U (US20020193084A1-20021219-M00002.png) 1987-09-18 1987-09-18

Country Status (1)

Country Link
JP (1) JPS6448027U (US20020193084A1-20021219-M00002.png)

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