JPS6448026U - - Google Patents

Info

Publication number
JPS6448026U
JPS6448026U JP1987144676U JP14467687U JPS6448026U JP S6448026 U JPS6448026 U JP S6448026U JP 1987144676 U JP1987144676 U JP 1987144676U JP 14467687 U JP14467687 U JP 14467687U JP S6448026 U JPS6448026 U JP S6448026U
Authority
JP
Japan
Prior art keywords
lead
heat sink
conveyance path
leads
recess
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1987144676U
Other languages
English (en)
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1987144676U priority Critical patent/JPS6448026U/ja
Publication of JPS6448026U publication Critical patent/JPS6448026U/ja
Pending legal-status Critical Current

Links

Classifications

    • H10W72/0198—

Landscapes

  • Die Bonding (AREA)
JP1987144676U 1987-09-21 1987-09-21 Pending JPS6448026U (enExample)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1987144676U JPS6448026U (enExample) 1987-09-21 1987-09-21

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1987144676U JPS6448026U (enExample) 1987-09-21 1987-09-21

Publications (1)

Publication Number Publication Date
JPS6448026U true JPS6448026U (enExample) 1989-03-24

Family

ID=31412590

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1987144676U Pending JPS6448026U (enExample) 1987-09-21 1987-09-21

Country Status (1)

Country Link
JP (1) JPS6448026U (enExample)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006332523A (ja) * 2005-05-30 2006-12-07 Hitachi High-Tech Instruments Co Ltd 半導体素子の装着装置

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006332523A (ja) * 2005-05-30 2006-12-07 Hitachi High-Tech Instruments Co Ltd 半導体素子の装着装置

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