JPS6448026U - - Google Patents
Info
- Publication number
- JPS6448026U JPS6448026U JP14467687U JP14467687U JPS6448026U JP S6448026 U JPS6448026 U JP S6448026U JP 14467687 U JP14467687 U JP 14467687U JP 14467687 U JP14467687 U JP 14467687U JP S6448026 U JPS6448026 U JP S6448026U
- Authority
- JP
- Japan
- Prior art keywords
- lead
- heat sink
- conveyance path
- leads
- recess
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/93—Batch processes
- H01L24/95—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips
- H01L24/97—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips the devices being connected to a common substrate, e.g. interposer, said common substrate being separable into individual assemblies after connecting
Landscapes
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Die Bonding (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP14467687U JPS6448026U (de) | 1987-09-21 | 1987-09-21 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP14467687U JPS6448026U (de) | 1987-09-21 | 1987-09-21 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6448026U true JPS6448026U (de) | 1989-03-24 |
Family
ID=31412590
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP14467687U Pending JPS6448026U (de) | 1987-09-21 | 1987-09-21 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6448026U (de) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2006332523A (ja) * | 2005-05-30 | 2006-12-07 | Hitachi High-Tech Instruments Co Ltd | 半導体素子の装着装置 |
-
1987
- 1987-09-21 JP JP14467687U patent/JPS6448026U/ja active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2006332523A (ja) * | 2005-05-30 | 2006-12-07 | Hitachi High-Tech Instruments Co Ltd | 半導体素子の装着装置 |
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