JPS6447053U - - Google Patents
Info
- Publication number
- JPS6447053U JPS6447053U JP14046687U JP14046687U JPS6447053U JP S6447053 U JPS6447053 U JP S6447053U JP 14046687 U JP14046687 U JP 14046687U JP 14046687 U JP14046687 U JP 14046687U JP S6447053 U JPS6447053 U JP S6447053U
- Authority
- JP
- Japan
- Prior art keywords
- circuit board
- printed circuit
- metal layer
- intermediate metal
- board package
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000002184 metal Substances 0.000 claims description 12
- 239000004065 semiconductor Substances 0.000 claims 1
- 239000011800 void material Substances 0.000 description 1
Landscapes
- Insulated Metal Substrates For Printed Circuits (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1987140466U JPH085559Y2 (ja) | 1987-09-14 | 1987-09-14 | プリント基板 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1987140466U JPH085559Y2 (ja) | 1987-09-14 | 1987-09-14 | プリント基板 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS6447053U true JPS6447053U (US20110009641A1-20110113-C00185.png) | 1989-03-23 |
| JPH085559Y2 JPH085559Y2 (ja) | 1996-02-14 |
Family
ID=31404663
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1987140466U Expired - Lifetime JPH085559Y2 (ja) | 1987-09-14 | 1987-09-14 | プリント基板 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH085559Y2 (US20110009641A1-20110113-C00185.png) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2013180088A1 (ja) * | 2012-05-30 | 2013-12-05 | 古河電気工業株式会社 | メタルコア基板、メタルコア基板の製造方法、及びこれらに用いられるコア板 |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2009016818A (ja) * | 2007-07-04 | 2009-01-22 | Samsung Electro-Mechanics Co Ltd | 多層印刷回路基板及びその製造方法 |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5880897A (ja) * | 1981-11-09 | 1983-05-16 | アンリツ株式会社 | 金属芯プリント配線板の製造方法 |
| JPS61287198A (ja) * | 1985-06-13 | 1986-12-17 | 松下電工株式会社 | 金属ベ−スプリント配線基板の製造方法 |
| JPS62134943A (ja) * | 1985-12-06 | 1987-06-18 | Katsusato Fujiyoshi | 半導体基板および半導体基板の製造方法 |
-
1987
- 1987-09-14 JP JP1987140466U patent/JPH085559Y2/ja not_active Expired - Lifetime
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5880897A (ja) * | 1981-11-09 | 1983-05-16 | アンリツ株式会社 | 金属芯プリント配線板の製造方法 |
| JPS61287198A (ja) * | 1985-06-13 | 1986-12-17 | 松下電工株式会社 | 金属ベ−スプリント配線基板の製造方法 |
| JPS62134943A (ja) * | 1985-12-06 | 1987-06-18 | Katsusato Fujiyoshi | 半導体基板および半導体基板の製造方法 |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2013180088A1 (ja) * | 2012-05-30 | 2013-12-05 | 古河電気工業株式会社 | メタルコア基板、メタルコア基板の製造方法、及びこれらに用いられるコア板 |
| JPWO2013180088A1 (ja) * | 2012-05-30 | 2016-01-21 | 古河電気工業株式会社 | メタルコア基板、メタルコア基板の製造方法、及びこれらに用いられるコア板 |
| US9942995B2 (en) | 2012-05-30 | 2018-04-10 | Furukawa Electric Co., Ltd. | Method for producing a metal core substrate having improved edge insulating properties |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH085559Y2 (ja) | 1996-02-14 |
