JPS6447040U - - Google Patents
Info
- Publication number
- JPS6447040U JPS6447040U JP14008887U JP14008887U JPS6447040U JP S6447040 U JPS6447040 U JP S6447040U JP 14008887 U JP14008887 U JP 14008887U JP 14008887 U JP14008887 U JP 14008887U JP S6447040 U JPS6447040 U JP S6447040U
- Authority
- JP
- Japan
- Prior art keywords
- mold
- cavity
- gates
- lower molds
- recesses
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 claims description 5
- 238000007789 sealing Methods 0.000 claims description 3
- 238000007599 discharging Methods 0.000 claims 1
- 239000011347 resin Substances 0.000 claims 1
- 229920005989 resin Polymers 0.000 claims 1
Landscapes
- Moulds For Moulding Plastics Or The Like (AREA)
- Injection Moulding Of Plastics Or The Like (AREA)
- Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP14008887U JPS6447040U (en18) | 1987-09-16 | 1987-09-16 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP14008887U JPS6447040U (en18) | 1987-09-16 | 1987-09-16 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6447040U true JPS6447040U (en18) | 1989-03-23 |
Family
ID=31403942
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP14008887U Pending JPS6447040U (en18) | 1987-09-16 | 1987-09-16 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6447040U (en18) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2017177540A (ja) * | 2016-03-30 | 2017-10-05 | 株式会社ケーヒン | 回路装置の製造方法及び回路装置 |
-
1987
- 1987-09-16 JP JP14008887U patent/JPS6447040U/ja active Pending
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2017177540A (ja) * | 2016-03-30 | 2017-10-05 | 株式会社ケーヒン | 回路装置の製造方法及び回路装置 |
| WO2017169173A1 (ja) * | 2016-03-30 | 2017-10-05 | 株式会社ケーヒン | 金型及び回路装置 |