JPS6445460A - Transparent polyamide having excellent solvent resistance - Google Patents

Transparent polyamide having excellent solvent resistance

Info

Publication number
JPS6445460A
JPS6445460A JP20213087A JP20213087A JPS6445460A JP S6445460 A JPS6445460 A JP S6445460A JP 20213087 A JP20213087 A JP 20213087A JP 20213087 A JP20213087 A JP 20213087A JP S6445460 A JPS6445460 A JP S6445460A
Authority
JP
Japan
Prior art keywords
transparent polyamide
solvent resistance
polymer
resultant blend
excellent solvent
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP20213087A
Other languages
Japanese (ja)
Other versions
JPH0345105B2 (en
Inventor
Nobuyuki Odagiri
Hajime Kishi
Ikuo Hagiwara
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toray Industries Inc
Original Assignee
Toray Industries Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toray Industries Inc filed Critical Toray Industries Inc
Priority to JP20213087A priority Critical patent/JPS6445460A/en
Publication of JPS6445460A publication Critical patent/JPS6445460A/en
Publication of JPH0345105B2 publication Critical patent/JPH0345105B2/ja
Granted legal-status Critical Current

Links

Abstract

PURPOSE:To obtain a transparent polyamide, capable of improving solvent resistance without impairing transparency and melt moldability and utilizable as films, molded products, powder, etc., by blending a transparent polyamide with a thermosetting resin and converting the resultant blend into semi-IPN. CONSTITUTION:A transparent polyamide obtained by, e.g. melting (A) a transparent polyamide having <=5cal/g, preferably <=1cal/g heat quantity of crystal melting measured by using a differential scanning calorimeter, preferably consisting of one or more of isophthalic acid, terephthalic acid, m- xylylenediamine, etc., as constituent components and (B) a thermosetting polymer, preferably epoxy polymer, especially epoxy polymer (e.g. tetraglycidylaminodiphenylmethane) prepared from amines, phenols and compounds having C=C as precursors in an amount of preferably <=80pts.wt. based on 100pts.wt. component (A) in combination with an epoxy curing agent while heating, homogeneously mixing the components and cooling the resultant blend into the form of a block.
JP20213087A 1987-08-13 1987-08-13 Transparent polyamide having excellent solvent resistance Granted JPS6445460A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP20213087A JPS6445460A (en) 1987-08-13 1987-08-13 Transparent polyamide having excellent solvent resistance

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP20213087A JPS6445460A (en) 1987-08-13 1987-08-13 Transparent polyamide having excellent solvent resistance

Publications (2)

Publication Number Publication Date
JPS6445460A true JPS6445460A (en) 1989-02-17
JPH0345105B2 JPH0345105B2 (en) 1991-07-10

Family

ID=16452461

Family Applications (1)

Application Number Title Priority Date Filing Date
JP20213087A Granted JPS6445460A (en) 1987-08-13 1987-08-13 Transparent polyamide having excellent solvent resistance

Country Status (1)

Country Link
JP (1) JPS6445460A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2007006425A3 (en) * 2005-07-11 2007-05-24 Dsm Ip Assets Bv Powder paint composition
US7271224B2 (en) * 2000-12-26 2007-09-18 Mitsubishi Gas Chemical Company, Inc. Composition for coating having a gas barrier property, coating and coated film having a gas barrier property used the same

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5521068A (en) * 1978-08-01 1980-02-14 Olympus Optical Co Ltd Camera capable of selecting motor drive device
JPS5823426A (en) * 1981-08-03 1983-02-12 日新電機株式会社 Condenser unit
JPS5889613A (en) * 1981-11-24 1983-05-28 Toray Ind Inc Curable resin composition
JPS61243859A (en) * 1985-04-22 1986-10-30 Jushi Kigata:Kk Surface-fortifying resin for resin mold

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5521068A (en) * 1978-08-01 1980-02-14 Olympus Optical Co Ltd Camera capable of selecting motor drive device
JPS5823426A (en) * 1981-08-03 1983-02-12 日新電機株式会社 Condenser unit
JPS5889613A (en) * 1981-11-24 1983-05-28 Toray Ind Inc Curable resin composition
JPS61243859A (en) * 1985-04-22 1986-10-30 Jushi Kigata:Kk Surface-fortifying resin for resin mold

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7271224B2 (en) * 2000-12-26 2007-09-18 Mitsubishi Gas Chemical Company, Inc. Composition for coating having a gas barrier property, coating and coated film having a gas barrier property used the same
WO2007006425A3 (en) * 2005-07-11 2007-05-24 Dsm Ip Assets Bv Powder paint composition
JP2009500506A (en) * 2005-07-11 2009-01-08 ディーエスエム アイピー アセッツ ビー．ブイ． Powder coating composition
EA013999B1 (en) * 2005-07-11 2010-08-30 ДСМ АйПи АССЕТС Б.В. Thermosetting binder composition, powder plant composition, a method for applying thereof, powder coating and substrates

Also Published As

Publication number Publication date
JPH0345105B2 (en) 1991-07-10

Similar Documents

Publication Publication Date Title
JPS6445460A (en) Transparent polyamide having excellent solvent resistance
JPH0379665A (en) Polyamide resin composition
JPS54142298A (en) Heat-resistant curable resin composition
US2238640A (en) Polymeric material
JPS56157424A (en) Curable resin composition
JPS5778447A (en) Phenolic resin molding material
JPS5483051A (en) Polyester resin composition
SU412214A1 (en) EPOXY COMPOSITION
JPS56157426A (en) Curable resin composition
JP3152924B2 (en) Melamine / phenol resin composition
JPS5911356A (en) Heat-resistant resin composition
JPH06128457A (en) Resin composition and molding material
JPS52134694A (en) Preparation of molding thermosetting resins
JPS60258250A (en) Resin composition
KR940004867B1 (en) Polyamide resin complsition
JPS60137046A (en) Light emitting/light receiving element sealer
JPS6218412A (en) Thermosetting resin composition
JPS5466958A (en) Polyester composition
JPS53141358A (en) Phenolic resin molding material and its preparation
JPS58108252A (en) Preparation of resin for injection molding
JPS56151711A (en) Heat-resistant resin composition
JPS6126652A (en) Molded phenolic resin article
JPH0827359A (en) Melamine/phenol resin composition
JPS6475582A (en) Injecting material composition for repairing concrete crack
JPS6327558A (en) Resin composition

Legal Events

Date Code Title Description
LAPS Cancellation because of no payment of annual fees