JPS6442843A - Semiconductor device - Google Patents
Semiconductor deviceInfo
- Publication number
- JPS6442843A JPS6442843A JP19931687A JP19931687A JPS6442843A JP S6442843 A JPS6442843 A JP S6442843A JP 19931687 A JP19931687 A JP 19931687A JP 19931687 A JP19931687 A JP 19931687A JP S6442843 A JPS6442843 A JP S6442843A
- Authority
- JP
- Japan
- Prior art keywords
- insulated substrate
- bottom plate
- side wall
- exposed
- resin side
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Landscapes
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP19931687A JPS6442843A (en) | 1987-08-10 | 1987-08-10 | Semiconductor device |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP19931687A JPS6442843A (en) | 1987-08-10 | 1987-08-10 | Semiconductor device |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS6442843A true JPS6442843A (en) | 1989-02-15 |
JPH0561780B2 JPH0561780B2 (enrdf_load_stackoverflow) | 1993-09-07 |
Family
ID=16405776
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP19931687A Granted JPS6442843A (en) | 1987-08-10 | 1987-08-10 | Semiconductor device |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS6442843A (enrdf_load_stackoverflow) |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0444346A (ja) * | 1990-06-11 | 1992-02-14 | Toshiba Corp | 封止型ハイブリッド回路装置 |
EP0788152A3 (en) * | 1996-01-30 | 1997-11-05 | Kabushiki Kaisha Toshiba | Internal compression bonded semiconductor device with a chip frame enabling a longer creepage distance |
JP2016036048A (ja) * | 2015-11-05 | 2016-03-17 | 住友電気工業株式会社 | 半導体モジュール |
-
1987
- 1987-08-10 JP JP19931687A patent/JPS6442843A/ja active Granted
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0444346A (ja) * | 1990-06-11 | 1992-02-14 | Toshiba Corp | 封止型ハイブリッド回路装置 |
EP0788152A3 (en) * | 1996-01-30 | 1997-11-05 | Kabushiki Kaisha Toshiba | Internal compression bonded semiconductor device with a chip frame enabling a longer creepage distance |
JP2016036048A (ja) * | 2015-11-05 | 2016-03-17 | 住友電気工業株式会社 | 半導体モジュール |
Also Published As
Publication number | Publication date |
---|---|
JPH0561780B2 (enrdf_load_stackoverflow) | 1993-09-07 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
LAPS | Cancellation because of no payment of annual fees |