JPS6440505U - - Google Patents

Info

Publication number

JPS6440505U

JPS6440505U JP13469587U JP13469587U JPS6440505U JP S6440505 U JPS6440505 U JP S6440505U JP 13469587 U JP13469587 U JP 13469587U JP 13469587 U JP13469587 U JP 13469587U JP S6440505 U JPS6440505 U JP S6440505U

Authority

JP

Japan

Prior art keywords

abrasive grain

substrate layer

grain density

cutting

dicing blade

Prior art date

1987-09-02

Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)

Pending

Links

• Espacenet
• Global Dossier
• Discuss

• 239000000758 substrate Substances 0.000 claims description 3
• 239000006061 abrasive grain Substances 0.000 claims 2
• 239000004065 semiconductor Substances 0.000 claims 2
• 235000012431 wafers Nutrition 0.000 claims 2
• 239000011230 binding agent Substances 0.000 claims 1
• 239000002184 metal Substances 0.000 claims 1
• 239000010410 layer Substances 0.000 description 3
• 239000002356 single layer Substances 0.000 description 1

Cited By (2)