JPS6440173A - Substrate heating device - Google Patents
Substrate heating deviceInfo
- Publication number
- JPS6440173A JPS6440173A JP19591387A JP19591387A JPS6440173A JP S6440173 A JPS6440173 A JP S6440173A JP 19591387 A JP19591387 A JP 19591387A JP 19591387 A JP19591387 A JP 19591387A JP S6440173 A JPS6440173 A JP S6440173A
- Authority
- JP
- Japan
- Prior art keywords
- substrate
- duct
- heated
- jet
- port
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Abstract
PURPOSE:To heat a substrate in short time with high efficiency by providing a fan and heating element inside the duct which arranges a blast port and suction port coaxially in opposition and making the flow of the liquid interposing the suction port a closed loop. CONSTITUTION:The air heated to an adequate temp. by a heating element 17 reaches to a blast port 11 through a duct 15 and jetted in a fixed direction into the atm. A substrate 2 is set up about in parallel to the flow at the downstream side of the jet and heated according to the temp. and flowing speed of the jet. And the jet having passed through the substrate 2 is sucked into the duct 15 from a suction port 13 again. In order to circulate the airstream of the duct 15 inside at about fixed speed a blower 14 is provided at the adequate place of the duct 15. And at the vicinity of this blower 14 the exhaust port 18 removing impurities contained in the airstream and the suction valve 16 inletting a fresh air may be provided. Since the heating fluid is heated by bringing it into contact with the substrate 2 even the substrate having a heat capacity distribution can therefore be heated by restraining the temp. distribution to the utmost.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP19591387A JPS6440173A (en) | 1987-08-05 | 1987-08-05 | Substrate heating device |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP19591387A JPS6440173A (en) | 1987-08-05 | 1987-08-05 | Substrate heating device |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS6440173A true JPS6440173A (en) | 1989-02-10 |
Family
ID=16349069
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP19591387A Pending JPS6440173A (en) | 1987-08-05 | 1987-08-05 | Substrate heating device |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS6440173A (en) |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2007234258A (en) * | 2006-02-27 | 2007-09-13 | Fujitsu Ltd | Printed circuit board unit |
US20100293901A1 (en) * | 2009-05-20 | 2010-11-25 | Martin Malthouse | Shrink Systems for Labels |
CN109420813A (en) * | 2017-08-25 | 2019-03-05 | 张跃 | A kind of hot air circulation soldering oven |
-
1987
- 1987-08-05 JP JP19591387A patent/JPS6440173A/en active Pending
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2007234258A (en) * | 2006-02-27 | 2007-09-13 | Fujitsu Ltd | Printed circuit board unit |
US20100293901A1 (en) * | 2009-05-20 | 2010-11-25 | Martin Malthouse | Shrink Systems for Labels |
CN109420813A (en) * | 2017-08-25 | 2019-03-05 | 张跃 | A kind of hot air circulation soldering oven |
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