JPS644011A - Through-type capacitor - Google Patents

Abstract

PURPOSE:To prevent a destruction phenomenon of a dielectric from being caused by a method wherein a central conductor having an uneven part on an external circumference face is brought into contact with an inner wall face of a through hole with a circular cross-section of the dielectric at an end part of a protruding part. CONSTITUTION:At a ceramic dielectric 1 an inner wall face of a through hole and an outer circumference face are metallized by a nickel-plating method or the like; a capacitor which uses the inner wall face and the outer circumference face as electrodes is formed. A central conductor 2 to be used as one electrode is inserted into the through hole of the dielectric 1, and is connected to the inner wall face of the hole by a soldering operation; a grounding electrode sheet 3 acting as the other electrode is soldered to the outer circumference face. External housings 4, 5 are attached to the grounding electrode sheet 3, and are fixed by injecting an insulating resin 6. End parts of narrow protruding parts at the central conductor 2 are connected to the inner wall face of the through hole at the dielectric 1 by using a solder 7. Because a width of each connection part is narrow, the solder protrudes due to a plastic deformation in a circumferential direction of the through hole at the dielectric; accordingly, a difference in thermal expansion between the central conductor 2 and the dielectric 1 can be absorbed. Because a space for an elastic deformation of the central conductor 2 is produced, the dielectric 1 is not damaged.