JPS6439728U - - Google Patents

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Publication number
JPS6439728U
JPS6439728U JP13534987U JP13534987U JPS6439728U JP S6439728 U JPS6439728 U JP S6439728U JP 13534987 U JP13534987 U JP 13534987U JP 13534987 U JP13534987 U JP 13534987U JP S6439728 U JPS6439728 U JP S6439728U
Authority
JP
Japan
Prior art keywords
tips
extends
tubes
water
pump
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP13534987U
Other languages
English (en)
Japanese (ja)
Other versions
JPH0423551Y2 (enrdf_load_stackoverflow
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1987135349U priority Critical patent/JPH0423551Y2/ja
Publication of JPS6439728U publication Critical patent/JPS6439728U/ja
Application granted granted Critical
Publication of JPH0423551Y2 publication Critical patent/JPH0423551Y2/ja
Expired legal-status Critical Current

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  • Massaging Devices (AREA)
JP1987135349U 1987-09-04 1987-09-04 Expired JPH0423551Y2 (enrdf_load_stackoverflow)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1987135349U JPH0423551Y2 (enrdf_load_stackoverflow) 1987-09-04 1987-09-04

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1987135349U JPH0423551Y2 (enrdf_load_stackoverflow) 1987-09-04 1987-09-04

Publications (2)

Publication Number Publication Date
JPS6439728U true JPS6439728U (enrdf_load_stackoverflow) 1989-03-09
JPH0423551Y2 JPH0423551Y2 (enrdf_load_stackoverflow) 1992-06-02

Family

ID=31394893

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1987135349U Expired JPH0423551Y2 (enrdf_load_stackoverflow) 1987-09-04 1987-09-04

Country Status (1)

Country Link
JP (1) JPH0423551Y2 (enrdf_load_stackoverflow)

Cited By (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0578229U (ja) * 1992-03-30 1993-10-26 株式会社イナックス 浴 槽
US7137353B2 (en) 2002-09-30 2006-11-21 Tokyo Electron Limited Method and apparatus for an improved deposition shield in a plasma processing system
US7147749B2 (en) 2002-09-30 2006-12-12 Tokyo Electron Limited Method and apparatus for an improved upper electrode plate with deposition shield in a plasma processing system
US7163585B2 (en) 2002-09-30 2007-01-16 Tokyo Electron Limited Method and apparatus for an improved optical window deposition shield in a plasma processing system
US7166200B2 (en) 2002-09-30 2007-01-23 Tokyo Electron Limited Method and apparatus for an improved upper electrode plate in a plasma processing system
US7166166B2 (en) 2002-09-30 2007-01-23 Tokyo Electron Limited Method and apparatus for an improved baffle plate in a plasma processing system
US7204912B2 (en) 2002-09-30 2007-04-17 Tokyo Electron Limited Method and apparatus for an improved bellows shield in a plasma processing system
US7282112B2 (en) 2002-09-30 2007-10-16 Tokyo Electron Limited Method and apparatus for an improved baffle plate in a plasma processing system
US7291566B2 (en) 2003-03-31 2007-11-06 Tokyo Electron Limited Barrier layer for a processing element and a method of forming the same
US7364798B2 (en) 1999-12-10 2008-04-29 Tocalo Co., Ltd. Internal member for plasma-treating vessel and method of producing the same
US7494723B2 (en) 2005-07-29 2009-02-24 Tocalo Co., Ltd. Y2O3 spray-coated member and production method thereof
US7552521B2 (en) 2004-12-08 2009-06-30 Tokyo Electron Limited Method and apparatus for improved baffle plate
US7560376B2 (en) 2003-03-31 2009-07-14 Tokyo Electron Limited Method for adjoining adjacent coatings on a processing element
US7601242B2 (en) 2005-01-11 2009-10-13 Tokyo Electron Limited Plasma processing system and baffle assembly for use in plasma processing system
US7648782B2 (en) 2006-03-20 2010-01-19 Tokyo Electron Limited Ceramic coating member for semiconductor processing apparatus
US7767268B2 (en) 2005-09-08 2010-08-03 Tocalo Co., Ltd. Spray-coated member having an excellent resistance to plasma erosion and method of producing the same
US7850864B2 (en) 2006-03-20 2010-12-14 Tokyo Electron Limited Plasma treating apparatus and plasma treating method
US8877002B2 (en) 2002-11-28 2014-11-04 Tokyo Electron Limited Internal member of a plasma processing vessel

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6180026U (enrdf_load_stackoverflow) * 1984-10-30 1986-05-28
JPS624329U (enrdf_load_stackoverflow) * 1985-06-25 1987-01-12

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6180026U (enrdf_load_stackoverflow) * 1984-10-30 1986-05-28
JPS624329U (enrdf_load_stackoverflow) * 1985-06-25 1987-01-12

Cited By (20)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0578229U (ja) * 1992-03-30 1993-10-26 株式会社イナックス 浴 槽
US7364798B2 (en) 1999-12-10 2008-04-29 Tocalo Co., Ltd. Internal member for plasma-treating vessel and method of producing the same
US7163585B2 (en) 2002-09-30 2007-01-16 Tokyo Electron Limited Method and apparatus for an improved optical window deposition shield in a plasma processing system
US7147749B2 (en) 2002-09-30 2006-12-12 Tokyo Electron Limited Method and apparatus for an improved upper electrode plate with deposition shield in a plasma processing system
US7166200B2 (en) 2002-09-30 2007-01-23 Tokyo Electron Limited Method and apparatus for an improved upper electrode plate in a plasma processing system
US7166166B2 (en) 2002-09-30 2007-01-23 Tokyo Electron Limited Method and apparatus for an improved baffle plate in a plasma processing system
US7204912B2 (en) 2002-09-30 2007-04-17 Tokyo Electron Limited Method and apparatus for an improved bellows shield in a plasma processing system
US7282112B2 (en) 2002-09-30 2007-10-16 Tokyo Electron Limited Method and apparatus for an improved baffle plate in a plasma processing system
US7137353B2 (en) 2002-09-30 2006-11-21 Tokyo Electron Limited Method and apparatus for an improved deposition shield in a plasma processing system
US7566379B2 (en) 2002-09-30 2009-07-28 Tokyo Electron Limited Method and apparatus for an improved upper electrode plate with deposition shield in a plasma processing system
US7566368B2 (en) 2002-09-30 2009-07-28 Tokyo Electron Limited Method and apparatus for an improved upper electrode plate in a plasma processing system
US8877002B2 (en) 2002-11-28 2014-11-04 Tokyo Electron Limited Internal member of a plasma processing vessel
US7291566B2 (en) 2003-03-31 2007-11-06 Tokyo Electron Limited Barrier layer for a processing element and a method of forming the same
US7560376B2 (en) 2003-03-31 2009-07-14 Tokyo Electron Limited Method for adjoining adjacent coatings on a processing element
US7552521B2 (en) 2004-12-08 2009-06-30 Tokyo Electron Limited Method and apparatus for improved baffle plate
US7601242B2 (en) 2005-01-11 2009-10-13 Tokyo Electron Limited Plasma processing system and baffle assembly for use in plasma processing system
US7494723B2 (en) 2005-07-29 2009-02-24 Tocalo Co., Ltd. Y2O3 spray-coated member and production method thereof
US7767268B2 (en) 2005-09-08 2010-08-03 Tocalo Co., Ltd. Spray-coated member having an excellent resistance to plasma erosion and method of producing the same
US7648782B2 (en) 2006-03-20 2010-01-19 Tokyo Electron Limited Ceramic coating member for semiconductor processing apparatus
US7850864B2 (en) 2006-03-20 2010-12-14 Tokyo Electron Limited Plasma treating apparatus and plasma treating method

Also Published As

Publication number Publication date
JPH0423551Y2 (enrdf_load_stackoverflow) 1992-06-02

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