JPS6439636U - - Google Patents
Info
- Publication number
- JPS6439636U JPS6439636U JP13230987U JP13230987U JPS6439636U JP S6439636 U JPS6439636 U JP S6439636U JP 13230987 U JP13230987 U JP 13230987U JP 13230987 U JP13230987 U JP 13230987U JP S6439636 U JPS6439636 U JP S6439636U
- Authority
- JP
- Japan
- Prior art keywords
- holding
- runner
- pressing force
- gate
- lead frame
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000005538 encapsulation Methods 0.000 claims description 3
- 239000004065 semiconductor Substances 0.000 claims description 3
- 238000010586 diagram Methods 0.000 description 2
- 125000006850 spacer group Chemical group 0.000 description 1
Landscapes
- Moulds For Moulding Plastics Or The Like (AREA)
- Injection Moulding Of Plastics Or The Like (AREA)
- Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP13230987U JPH0514510Y2 (https=) | 1987-09-01 | 1987-09-01 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP13230987U JPH0514510Y2 (https=) | 1987-09-01 | 1987-09-01 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS6439636U true JPS6439636U (https=) | 1989-03-09 |
| JPH0514510Y2 JPH0514510Y2 (https=) | 1993-04-19 |
Family
ID=31389151
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP13230987U Expired - Lifetime JPH0514510Y2 (https=) | 1987-09-01 | 1987-09-01 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0514510Y2 (https=) |
-
1987
- 1987-09-01 JP JP13230987U patent/JPH0514510Y2/ja not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0514510Y2 (https=) | 1993-04-19 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JPS6439636U (https=) | ||
| JP2501051Y2 (ja) | 半導体製品リ―ド切断整形金型 | |
| JPS6275910U (https=) | ||
| JPS6439740A (en) | Resin sealer for semiconductor device | |
| JPH02104636U (https=) | ||
| JPH0233451U (https=) | ||
| JPH01169030U (https=) | ||
| JPH01113333U (https=) | ||
| JPH0272557U (https=) | ||
| JPH0390454U (https=) | ||
| JP2538431Y2 (ja) | 半導体圧潰装置 | |
| JPS6364046U (https=) | ||
| JPH0442744U (https=) | ||
| JPH02110336U (https=) | ||
| JPS6365237U (https=) | ||
| JPH028034U (https=) | ||
| JPS63108709U (https=) | ||
| JPH02108346U (https=) | ||
| JPS60121428U (ja) | プレス型におけるワ−クの離型装置 | |
| JPH0350342U (https=) | ||
| JPH0211345U (https=) | ||
| JPH01156016U (https=) | ||
| JPH0452021U (https=) | ||
| JPS6337212U (https=) | ||
| JPS592996U (ja) | 圧縮機の吸込弁 |