JPS6437040U - - Google Patents
Info
- Publication number
- JPS6437040U JPS6437040U JP1987132070U JP13207087U JPS6437040U JP S6437040 U JPS6437040 U JP S6437040U JP 1987132070 U JP1987132070 U JP 1987132070U JP 13207087 U JP13207087 U JP 13207087U JP S6437040 U JPS6437040 U JP S6437040U
- Authority
- JP
- Japan
- Prior art keywords
- cylindrical portion
- semiconductor chip
- tip
- vacuum
- accommodates
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H10W72/0711—
-
- H10W72/07141—
-
- H10W72/073—
Landscapes
- Die Bonding (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1987132070U JPS6437040U (OSRAM) | 1987-08-28 | 1987-08-28 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1987132070U JPS6437040U (OSRAM) | 1987-08-28 | 1987-08-28 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6437040U true JPS6437040U (OSRAM) | 1989-03-06 |
Family
ID=31388701
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1987132070U Pending JPS6437040U (OSRAM) | 1987-08-28 | 1987-08-28 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6437040U (OSRAM) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2019212801A (ja) * | 2018-06-06 | 2019-12-12 | 株式会社デンソー | 半導体装置およびその製造方法 |
-
1987
- 1987-08-28 JP JP1987132070U patent/JPS6437040U/ja active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2019212801A (ja) * | 2018-06-06 | 2019-12-12 | 株式会社デンソー | 半導体装置およびその製造方法 |