JPS6436042A - Method and device for wafer handling in semiconductor manufacturing apparatus - Google Patents

Method and device for wafer handling in semiconductor manufacturing apparatus

Info

Publication number
JPS6436042A
JPS6436042A JP19217087A JP19217087A JPS6436042A JP S6436042 A JPS6436042 A JP S6436042A JP 19217087 A JP19217087 A JP 19217087A JP 19217087 A JP19217087 A JP 19217087A JP S6436042 A JPS6436042 A JP S6436042A
Authority
JP
Japan
Prior art keywords
wafers
wafer
cassette
tweezers
tilted
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP19217087A
Other languages
English (en)
Inventor
Akinosuke Takahashi
Kazuo Sasada
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Kokusai Electric Corp
Original Assignee
Kokusai Electric Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Kokusai Electric Corp filed Critical Kokusai Electric Corp
Priority to JP19217087A priority Critical patent/JPS6436042A/ja
Publication of JPS6436042A publication Critical patent/JPS6436042A/ja
Pending legal-status Critical Current

Links

JP19217087A 1987-07-31 1987-07-31 Method and device for wafer handling in semiconductor manufacturing apparatus Pending JPS6436042A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP19217087A JPS6436042A (en) 1987-07-31 1987-07-31 Method and device for wafer handling in semiconductor manufacturing apparatus

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP19217087A JPS6436042A (en) 1987-07-31 1987-07-31 Method and device for wafer handling in semiconductor manufacturing apparatus

Publications (1)

Publication Number Publication Date
JPS6436042A true JPS6436042A (en) 1989-02-07

Family

ID=16286848

Family Applications (1)

Application Number Title Priority Date Filing Date
JP19217087A Pending JPS6436042A (en) 1987-07-31 1987-07-31 Method and device for wafer handling in semiconductor manufacturing apparatus

Country Status (1)

Country Link
JP (1) JPS6436042A (ja)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6880264B2 (en) 1990-08-29 2005-04-19 Hitachi, Ltd. Vacuum processing apparatus and operating method therefor
JP2007029908A (ja) * 2005-07-29 2007-02-08 Mitsui Miike Mach Co Ltd 破砕機

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6019656A (ja) * 1983-07-15 1985-01-31 Fuji Xerox Co Ltd ソ−タ装置

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6019656A (ja) * 1983-07-15 1985-01-31 Fuji Xerox Co Ltd ソ−タ装置

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6880264B2 (en) 1990-08-29 2005-04-19 Hitachi, Ltd. Vacuum processing apparatus and operating method therefor
US6886272B2 (en) 1990-08-29 2005-05-03 Hitachi, Ltd. Vacuum processing apparatus and operating method therefor
US6904699B2 (en) 1990-08-29 2005-06-14 Hitachi, Ltd. Vacuum processing apparatus and operating method therefor
US6968630B2 (en) 1990-08-29 2005-11-29 Hitachi, Ltd. Vacuum processing apparatus and operating method therefor
JP2007029908A (ja) * 2005-07-29 2007-02-08 Mitsui Miike Mach Co Ltd 破砕機

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