JPS6436035A - Device for dispensing fixed-amount of adhesive - Google Patents

Device for dispensing fixed-amount of adhesive

Info

Publication number
JPS6436035A
JPS6436035A JP19190087A JP19190087A JPS6436035A JP S6436035 A JPS6436035 A JP S6436035A JP 19190087 A JP19190087 A JP 19190087A JP 19190087 A JP19190087 A JP 19190087A JP S6436035 A JPS6436035 A JP S6436035A
Authority
JP
Japan
Prior art keywords
adhesive
spiral rod
needle
syringe
height
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP19190087A
Other languages
Japanese (ja)
Inventor
Hidekazu Tamura
Joshi Narui
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Denso Ten Ltd
Original Assignee
Denso Ten Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Denso Ten Ltd filed Critical Denso Ten Ltd
Priority to JP19190087A priority Critical patent/JPS6436035A/en
Publication of JPS6436035A publication Critical patent/JPS6436035A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
    • H01L24/741—Apparatus for manufacturing means for bonding, e.g. connectors
    • H01L24/743—Apparatus for manufacturing layer connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/741—Apparatus for manufacturing means for bonding, e.g. connectors
    • H01L2224/743—Apparatus for manufacturing layer connectors

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Coating Apparatus (AREA)
  • Die Bonding (AREA)

Abstract

PURPOSE:To stabilize a dispensed amount at each operation by a method wherein a spiral rod having a through hole in an axial direction is installed inside a needle to be freely turned and to be movable in the axial direction and an excess part of a dispensed adhesive is recovered by turning the rod. CONSTITUTION:A syringe 4 and a needle 2 at its tip part are raised collectively by an elevator device; a rotary shaft 9 and a spiral rod 7 are raised collectively by the elevator device. If the needle 2 and the spiral rod 7 are lowered by a length acute angleA in this state, an opening end B of the needle 2 closely adheres to the surface of a substrate 1; if an air pressure is impressed to the inside of the syringe 4 from a dispenser, an adhesive 3 inside the syringe 4 fills a blocked space 20 through a through hole 14. A height of the space 20 at this stage is higher by alpha than a target height h. Accordingly, because an excess adhesive is dispensed, the spiral rod 7 is lowered further by alpha and the height of the space 20 is set to the target height h. During this process, the spiral rod 7 is turned and an excess part 3' of the adhesive 3 is recovered.
JP19190087A 1987-07-31 1987-07-31 Device for dispensing fixed-amount of adhesive Pending JPS6436035A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP19190087A JPS6436035A (en) 1987-07-31 1987-07-31 Device for dispensing fixed-amount of adhesive

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP19190087A JPS6436035A (en) 1987-07-31 1987-07-31 Device for dispensing fixed-amount of adhesive

Publications (1)

Publication Number Publication Date
JPS6436035A true JPS6436035A (en) 1989-02-07

Family

ID=16282315

Family Applications (1)

Application Number Title Priority Date Filing Date
JP19190087A Pending JPS6436035A (en) 1987-07-31 1987-07-31 Device for dispensing fixed-amount of adhesive

Country Status (1)

Country Link
JP (1) JPS6436035A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5293041A (en) * 1991-11-04 1994-03-08 Honeywell Inc. Thin film pyroelectric imaging array
JP2007289655A (en) * 2006-03-27 2007-11-08 Minoru Nakamura Syringe pump

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5293041A (en) * 1991-11-04 1994-03-08 Honeywell Inc. Thin film pyroelectric imaging array
JP2007289655A (en) * 2006-03-27 2007-11-08 Minoru Nakamura Syringe pump

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