JPS6435794U - - Google Patents

Info

Publication number
JPS6435794U
JPS6435794U JP1987129483U JP12948387U JPS6435794U JP S6435794 U JPS6435794 U JP S6435794U JP 1987129483 U JP1987129483 U JP 1987129483U JP 12948387 U JP12948387 U JP 12948387U JP S6435794 U JPS6435794 U JP S6435794U
Authority
JP
Japan
Prior art keywords
cooling
cooling plate
flange portion
ring
refrigerant
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP1987129483U
Other languages
English (en)
Japanese (ja)
Other versions
JPH0530394Y2 (enFirst
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1987129483U priority Critical patent/JPH0530394Y2/ja
Publication of JPS6435794U publication Critical patent/JPS6435794U/ja
Application granted granted Critical
Publication of JPH0530394Y2 publication Critical patent/JPH0530394Y2/ja
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10WGENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00Interconnections or connectors in packages
    • H10W72/851Dispositions of multiple connectors or interconnections
    • H10W72/874On different surfaces
    • H10W72/877Bump connectors and die-attach connectors
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10WGENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00Package configurations
    • H10W90/701Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/721Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors
    • H10W90/724Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors between a chip and a stacked insulating package substrate, interposer or RDL

Landscapes

  • Cooling Or The Like Of Electrical Apparatus (AREA)
JP1987129483U 1987-08-26 1987-08-26 Expired - Lifetime JPH0530394Y2 (enFirst)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1987129483U JPH0530394Y2 (enFirst) 1987-08-26 1987-08-26

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1987129483U JPH0530394Y2 (enFirst) 1987-08-26 1987-08-26

Publications (2)

Publication Number Publication Date
JPS6435794U true JPS6435794U (enFirst) 1989-03-03
JPH0530394Y2 JPH0530394Y2 (enFirst) 1993-08-03

Family

ID=31383799

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1987129483U Expired - Lifetime JPH0530394Y2 (enFirst) 1987-08-26 1987-08-26

Country Status (1)

Country Link
JP (1) JPH0530394Y2 (enFirst)

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5737258U (enFirst) * 1980-08-11 1982-02-27
JPS6267844A (ja) * 1985-09-20 1987-03-27 Fujitsu Ltd 冷却構造

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5737258U (enFirst) * 1980-08-11 1982-02-27
JPS6267844A (ja) * 1985-09-20 1987-03-27 Fujitsu Ltd 冷却構造

Also Published As

Publication number Publication date
JPH0530394Y2 (enFirst) 1993-08-03

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