JPS6435744U - - Google Patents
Info
- Publication number
- JPS6435744U JPS6435744U JP13119587U JP13119587U JPS6435744U JP S6435744 U JPS6435744 U JP S6435744U JP 13119587 U JP13119587 U JP 13119587U JP 13119587 U JP13119587 U JP 13119587U JP S6435744 U JPS6435744 U JP S6435744U
- Authority
- JP
- Japan
- Prior art keywords
- semiconductor chip
- semiconductor device
- base part
- wire
- view
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000004065 semiconductor Substances 0.000 claims description 11
- 239000002184 metal Substances 0.000 claims description 3
- 230000001681 protective effect Effects 0.000 claims 1
- 238000004519 manufacturing process Methods 0.000 description 2
- 239000004020 conductor Substances 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
Landscapes
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
- Wire Bonding (AREA)
- Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1987131195U JPH0543477Y2 (US06168655-20010102-C00055.png) | 1987-08-28 | 1987-08-28 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1987131195U JPH0543477Y2 (US06168655-20010102-C00055.png) | 1987-08-28 | 1987-08-28 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS6435744U true JPS6435744U (US06168655-20010102-C00055.png) | 1989-03-03 |
| JPH0543477Y2 JPH0543477Y2 (US06168655-20010102-C00055.png) | 1993-11-02 |
Family
ID=31387034
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1987131195U Expired - Lifetime JPH0543477Y2 (US06168655-20010102-C00055.png) | 1987-08-28 | 1987-08-28 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0543477Y2 (US06168655-20010102-C00055.png) |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5396969U (US06168655-20010102-C00055.png) * | 1978-01-10 | 1978-08-07 |
-
1987
- 1987-08-28 JP JP1987131195U patent/JPH0543477Y2/ja not_active Expired - Lifetime
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5396969U (US06168655-20010102-C00055.png) * | 1978-01-10 | 1978-08-07 |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0543477Y2 (US06168655-20010102-C00055.png) | 1993-11-02 |
