JPS6435528U - - Google Patents
Info
- Publication number
- JPS6435528U JPS6435528U JP12795487U JP12795487U JPS6435528U JP S6435528 U JPS6435528 U JP S6435528U JP 12795487 U JP12795487 U JP 12795487U JP 12795487 U JP12795487 U JP 12795487U JP S6435528 U JPS6435528 U JP S6435528U
- Authority
- JP
- Japan
- Prior art keywords
- heater
- temperature
- humidity
- sensor
- dew point
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 230000005494 condensation Effects 0.000 claims description 2
- 238000009833 condensation Methods 0.000 claims description 2
- 230000002265 prevention Effects 0.000 claims 1
- 238000010586 diagram Methods 0.000 description 1
Landscapes
- Investigating Or Analyzing Materials By The Use Of Fluid Adsorption Or Reactions (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP12795487U JPS6435528U (cs) | 1987-08-22 | 1987-08-22 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP12795487U JPS6435528U (cs) | 1987-08-22 | 1987-08-22 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6435528U true JPS6435528U (cs) | 1989-03-03 |
Family
ID=31380850
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP12795487U Pending JPS6435528U (cs) | 1987-08-22 | 1987-08-22 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6435528U (cs) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7215018B2 (en) | 2004-04-13 | 2007-05-08 | Vertical Circuits, Inc. | Stacked die BGA or LGA component assembly |
| US7245021B2 (en) | 2004-04-13 | 2007-07-17 | Vertical Circuits, Inc. | Micropede stacked die component assembly |
| US7521797B2 (en) | 2004-03-18 | 2009-04-21 | Seiko Epson Corporation | Method of manufacturing substrate joint body, substrate joint body and electrooptical device |
-
1987
- 1987-08-22 JP JP12795487U patent/JPS6435528U/ja active Pending
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7521797B2 (en) | 2004-03-18 | 2009-04-21 | Seiko Epson Corporation | Method of manufacturing substrate joint body, substrate joint body and electrooptical device |
| US7215018B2 (en) | 2004-04-13 | 2007-05-08 | Vertical Circuits, Inc. | Stacked die BGA or LGA component assembly |
| US7245021B2 (en) | 2004-04-13 | 2007-07-17 | Vertical Circuits, Inc. | Micropede stacked die component assembly |