JPS6435528U - - Google Patents

Info

Publication number
JPS6435528U
JPS6435528U JP12795487U JP12795487U JPS6435528U JP S6435528 U JPS6435528 U JP S6435528U JP 12795487 U JP12795487 U JP 12795487U JP 12795487 U JP12795487 U JP 12795487U JP S6435528 U JPS6435528 U JP S6435528U
Authority
JP
Grant status
Application
Patent type
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP12795487U
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date

Links

JP12795487U 1987-08-22 1987-08-22 Pending JPS6435528U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP12795487U JPS6435528U (en) 1987-08-22 1987-08-22

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP12795487U JPS6435528U (en) 1987-08-22 1987-08-22

Publications (1)

Publication Number Publication Date
JPS6435528U true true JPS6435528U (en) 1989-03-03

Family

ID=31380850

Family Applications (1)

Application Number Title Priority Date Filing Date
JP12795487U Pending JPS6435528U (en) 1987-08-22 1987-08-22

Country Status (1)

Country Link
JP (1) JPS6435528U (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7215018B2 (en) 2004-04-13 2007-05-08 Vertical Circuits, Inc. Stacked die BGA or LGA component assembly
US7245021B2 (en) 2004-04-13 2007-07-17 Vertical Circuits, Inc. Micropede stacked die component assembly
US7521797B2 (en) 2004-03-18 2009-04-21 Seiko Epson Corporation Method of manufacturing substrate joint body, substrate joint body and electrooptical device

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7521797B2 (en) 2004-03-18 2009-04-21 Seiko Epson Corporation Method of manufacturing substrate joint body, substrate joint body and electrooptical device
US7215018B2 (en) 2004-04-13 2007-05-08 Vertical Circuits, Inc. Stacked die BGA or LGA component assembly
US7245021B2 (en) 2004-04-13 2007-07-17 Vertical Circuits, Inc. Micropede stacked die component assembly

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