JPS64339U - - Google Patents
Info
- Publication number
- JPS64339U JPS64339U JP9445987U JP9445987U JPS64339U JP S64339 U JPS64339 U JP S64339U JP 9445987 U JP9445987 U JP 9445987U JP 9445987 U JP9445987 U JP 9445987U JP S64339 U JPS64339 U JP S64339U
- Authority
- JP
- Japan
- Prior art keywords
- semiconductor device
- protruding piece
- top surface
- bottom face
- side faces
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 claims description 8
- 238000001816 cooling Methods 0.000 claims description 3
Landscapes
- Cooling Or The Like Of Electrical Apparatus (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP9445987U JPS64339U (xx) | 1987-06-19 | 1987-06-19 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP9445987U JPS64339U (xx) | 1987-06-19 | 1987-06-19 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS64339U true JPS64339U (xx) | 1989-01-05 |
Family
ID=30957945
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP9445987U Pending JPS64339U (xx) | 1987-06-19 | 1987-06-19 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS64339U (xx) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH03194957A (ja) * | 1989-12-21 | 1991-08-26 | Internatl Business Mach Corp <Ibm> | プラスチツク・チツプ回路パツケージ、電子部品の熱放散強化方法、ヒート・シンク・エレメントの取付方法 |
-
1987
- 1987-06-19 JP JP9445987U patent/JPS64339U/ja active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH03194957A (ja) * | 1989-12-21 | 1991-08-26 | Internatl Business Mach Corp <Ibm> | プラスチツク・チツプ回路パツケージ、電子部品の熱放散強化方法、ヒート・シンク・エレメントの取付方法 |