JPS6433134A - Low-stress polyimide precursor - Google Patents
Low-stress polyimide precursorInfo
- Publication number
- JPS6433134A JPS6433134A JP18898587A JP18898587A JPS6433134A JP S6433134 A JPS6433134 A JP S6433134A JP 18898587 A JP18898587 A JP 18898587A JP 18898587 A JP18898587 A JP 18898587A JP S6433134 A JPS6433134 A JP S6433134A
- Authority
- JP
- Japan
- Prior art keywords
- repeating units
- low
- group
- tetracarboxylic
- diamine
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Polymers With Sulfur, Phosphorus Or Metals In The Main Chain (AREA)
- Macromolecular Compounds Obtained By Forming Nitrogen-Containing Linkages In General (AREA)
Abstract
PURPOSE:To obtain the title precursor low in stress, excellent in heat resistance and mechanical strengths and low in a coefficient of thermal expansion, by condensing a tetracarboxylic diester obtained from a tetracarboxylic dianhydride with an alcohol with a diamine. CONSTITUTION:A tetracarboxylic diester is obtained by reacting a tetracarboxylic dianhydride (A) (e.g., pyromellitic dianhydride) with an alcohol (e.g., 2-hydroxylethyl methacrylate) free of any functional group equivalent to a COOH or NH2 group in reactivity. This compound is condensed with a diamine (C) (e.g., p-phenylenediamine) to obtain the title precursor which is a polyamic ester containing at least two kinds of repeating units which are different from each other in part except R1 among repeating units of formulas I and II (wherein R1 is a 1-20 C organic group, R2 is H or CH3, Ar is a group of formula III or IV and n is 0-4) and in which the ratio of the respective repeating units which are the same in part except R1 to the total repeating units is 70mol% or below.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP18898587A JPS6433134A (en) | 1987-07-30 | 1987-07-30 | Low-stress polyimide precursor |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP18898587A JPS6433134A (en) | 1987-07-30 | 1987-07-30 | Low-stress polyimide precursor |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6433134A true JPS6433134A (en) | 1989-02-03 |
Family
ID=16233370
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP18898587A Pending JPS6433134A (en) | 1987-07-30 | 1987-07-30 | Low-stress polyimide precursor |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6433134A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2008192350A (en) * | 2007-02-01 | 2008-08-21 | Asahi Denso Co Ltd | Switch device |
| JP2019119126A (en) * | 2018-01-04 | 2019-07-22 | 東洋紡株式会社 | Laminate, production method of laminate, production method of flexible electronic device |
-
1987
- 1987-07-30 JP JP18898587A patent/JPS6433134A/en active Pending
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2008192350A (en) * | 2007-02-01 | 2008-08-21 | Asahi Denso Co Ltd | Switch device |
| JP2019119126A (en) * | 2018-01-04 | 2019-07-22 | 東洋紡株式会社 | Laminate, production method of laminate, production method of flexible electronic device |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| EP0896014B1 (en) | Soluble polyimide resin, process for preparing the same, and polyimide resin solution composition | |
| DE3587783D1 (en) | Polyamic acids, polyimides, poly (esterimides). | |
| JPS5638038A (en) | Photosensitive polyimide precursor | |
| US4670497A (en) | Soluble silicone-imide copolymers | |
| JPS6433134A (en) | Low-stress polyimide precursor | |
| US4952669A (en) | Copolyimides prepared from 2-(3-aminophenyl)-2-(4-aminophenyl) Hexafluoro propane | |
| JPS59189122A (en) | Fluorine-containing polyamic acid, polyimide and material | |
| KR910009779A (en) | Polyimide Manufacturing Method | |
| KR100329283B1 (en) | Triarylphosphine oxide derivatives having fluorine-containing substituents | |
| KR890013087A (en) | Manufacturing method of polyimide | |
| US4968757A (en) | Soluble silicone-imide copolymers | |
| JPS56161457A (en) | Heat-resisting resin composition | |
| US5886131A (en) | Method for preparing 1,4-Bis(4-aminophenoxy)naphthalene and its polymers | |
| JPS6416834A (en) | Polyamic acid copolymer, polyimide copolymer therefrom and production thereof | |
| JPS5742732A (en) | Production of polyamido acid silicone type intermediate and polyimidoisoindoloquinazolinedione/silicone copolymer resin | |
| US4978742A (en) | Polymers prepared from 2-(3-aminophenyl)-2-(4-aminophenyl) hexafluoro propane | |
| US5844065A (en) | 2,2'-dimethyl-4,4'-bis (4-aminophenoxy) biphenyl, and polymers prepared therefrom by polycondensation | |
| SG58592G (en) | Use of polymides prepared from polyamide acids | |
| JPS6433133A (en) | Reactive polyamic acid and its production | |
| KR100211440B1 (en) | Novel polyimides and process for producing the same | |
| JPS6422923A (en) | Production of polyamide | |
| JPS644682A (en) | Heat-resistant adhesive composition | |
| JPS6438436A (en) | Aromatic polyamide resin and its production | |
| US5834581A (en) | Process for making polyimide-polyamic ester copolymers | |
| US5817741A (en) | Flexible diamine compound, and polyamide and polyimide prepared therefrom by polycondensation |