JPS6432660A - Pin grid array - Google Patents
Pin grid arrayInfo
- Publication number
- JPS6432660A JPS6432660A JP9245387A JP9245387A JPS6432660A JP S6432660 A JPS6432660 A JP S6432660A JP 9245387 A JP9245387 A JP 9245387A JP 9245387 A JP9245387 A JP 9245387A JP S6432660 A JPS6432660 A JP S6432660A
- Authority
- JP
- Japan
- Prior art keywords
- substrate
- pins
- side face
- another
- loading section
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Abstract
PURPOSE:To ensure an area for fitting terminal pins, and to increase the number of the pins by forming blind holes to another one side face of a substrate in a section corresponding to a semiconductor-chip loading section, inserting the terminal pins and projecting the terminal pins from another one surface of the substrate. CONSTITUTION:A semiconductor-chip loading section 2 is shaped to one side face of a substrate 1 formed by a resin material, and through-holes 3 are shaped to the substrate 1 in sections except the loading section 2. Blind holes 4 are formed to another one side face of the substrate 1 in a section corresponding to the loading section. The base sections of terminal pins 5 are inserted into the through-holes 3 and the blind holes 4, and the pins 5 are projected from another one side face of the substrate 1. Accordingly, the number of the pins 5 is increased without requiring the scaling-up of the substrate 1.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP9245387A JPS6432660A (en) | 1987-04-15 | 1987-04-15 | Pin grid array |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP9245387A JPS6432660A (en) | 1987-04-15 | 1987-04-15 | Pin grid array |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS6432660A true JPS6432660A (en) | 1989-02-02 |
| JPH0440861B2 JPH0440861B2 (en) | 1992-07-06 |
Family
ID=14054813
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP9245387A Granted JPS6432660A (en) | 1987-04-15 | 1987-04-15 | Pin grid array |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6432660A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5290861A (en) * | 1990-09-03 | 1994-03-01 | Japan Synthetic Rubber Co., Ltd. | Thermoplastic resin composition |
| US6034441A (en) * | 1997-11-26 | 2000-03-07 | Lucent Technologies, Inc. | Overcast semiconductor package |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4338621A (en) * | 1980-02-04 | 1982-07-06 | Burroughs Corporation | Hermetic integrated circuit package for high density high power applications |
| JPS60187098A (en) * | 1984-03-07 | 1985-09-24 | イビデン株式会社 | Plug-in package substrate |
| JPS63254799A (en) * | 1987-04-10 | 1988-10-21 | イビデン株式会社 | Surface mount component shielding package |
-
1987
- 1987-04-15 JP JP9245387A patent/JPS6432660A/en active Granted
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4338621A (en) * | 1980-02-04 | 1982-07-06 | Burroughs Corporation | Hermetic integrated circuit package for high density high power applications |
| JPS60187098A (en) * | 1984-03-07 | 1985-09-24 | イビデン株式会社 | Plug-in package substrate |
| JPS63254799A (en) * | 1987-04-10 | 1988-10-21 | イビデン株式会社 | Surface mount component shielding package |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5290861A (en) * | 1990-09-03 | 1994-03-01 | Japan Synthetic Rubber Co., Ltd. | Thermoplastic resin composition |
| US6034441A (en) * | 1997-11-26 | 2000-03-07 | Lucent Technologies, Inc. | Overcast semiconductor package |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0440861B2 (en) | 1992-07-06 |
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