JPS6429862U - - Google Patents

Info

Publication number
JPS6429862U
JPS6429862U JP1987124658U JP12465887U JPS6429862U JP S6429862 U JPS6429862 U JP S6429862U JP 1987124658 U JP1987124658 U JP 1987124658U JP 12465887 U JP12465887 U JP 12465887U JP S6429862 U JPS6429862 U JP S6429862U
Authority
JP
Japan
Prior art keywords
light emitting
emitting diode
shape
groove
item
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP1987124658U
Other languages
English (en)
Other versions
JPH0521894Y2 (ja
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1987124658U priority Critical patent/JPH0521894Y2/ja
Publication of JPS6429862U publication Critical patent/JPS6429862U/ja
Application granted granted Critical
Publication of JPH0521894Y2 publication Critical patent/JPH0521894Y2/ja
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/756—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink

Landscapes

  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)

Description

【図面の簡単な説明】
第１図は本考案に係る第１実施例の発光ダイオ
ードを示す断面図、第２図は同発光ダイオードの
下面図、第３図は本考案の第２実施例の発光ダイ
オードを示す断面図、第４図は同発光ダイオード
の下面図、第５図は従来例の発光ダイオードの断
面図である。 １……ＬＥＤチツプ、２，３……リード、４…
…金属ワイヤー、５，５ａ……樹脂モールド、６
，６ａ……溝部。

Claims (1)

  1. 【実用新案登録請求の範囲】 (1) 樹脂モールドタイプの発光ダイオードにお
    いて、後端側に周側縁に沿う溝部を形成したこと
    を特徴とする発光ダイオード。 (2) 溝部の断面形状が、弧状、Ｕ字状又はＶ字
    状である前記第１項記載の発光ダイオード。
JP1987124658U 1987-08-14 1987-08-14 Expired - Lifetime JPH0521894Y2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1987124658U JPH0521894Y2 (ja) 1987-08-14 1987-08-14

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1987124658U JPH0521894Y2 (ja) 1987-08-14 1987-08-14

Publications (2)

Publication Number Publication Date
JPS6429862U true JPS6429862U (ja) 1989-02-22
JPH0521894Y2 JPH0521894Y2 (ja) 1993-06-04

Family

ID=31374588

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1987124658U Expired - Lifetime JPH0521894Y2 (ja) 1987-08-14 1987-08-14

Country Status (1)

Country Link
JP (1) JPH0521894Y2 (ja)

Also Published As

Publication number Publication date
JPH0521894Y2 (ja) 1993-06-04

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