JPS6429839U - - Google Patents
Info
- Publication number
- JPS6429839U JPS6429839U JP12451187U JP12451187U JPS6429839U JP S6429839 U JPS6429839 U JP S6429839U JP 12451187 U JP12451187 U JP 12451187U JP 12451187 U JP12451187 U JP 12451187U JP S6429839 U JPS6429839 U JP S6429839U
- Authority
- JP
- Japan
- Prior art keywords
- chip
- element area
- sealing structure
- circuit board
- printed circuit
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000007789 sealing Methods 0.000 claims description 6
- 239000011347 resin Substances 0.000 claims description 5
- 229920005989 resin Polymers 0.000 claims description 5
- 239000000463 material Substances 0.000 claims 1
- 238000007796 conventional method Methods 0.000 description 1
Landscapes
- Electric Clocks (AREA)
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP12451187U JPS6429839U (es) | 1987-08-14 | 1987-08-14 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP12451187U JPS6429839U (es) | 1987-08-14 | 1987-08-14 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6429839U true JPS6429839U (es) | 1989-02-22 |
Family
ID=31374306
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP12451187U Pending JPS6429839U (es) | 1987-08-14 | 1987-08-14 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6429839U (es) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH07231194A (ja) * | 1994-02-18 | 1995-08-29 | Nec Commun Syst Ltd | Ｅｍｉ対策処理用ラジエータ |
| WO2001008220A1 (fr) * | 1999-07-28 | 2001-02-01 | Hitachi, Ltd. | Dispositif semi-conducteur |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS53112061A (en) * | 1977-03-11 | 1978-09-30 | Sharp Corp | Wiring substrate of semiconductor chip |
| JPS58134449A (ja) * | 1982-02-04 | 1983-08-10 | Sharp Corp | Ｌｓｉパツケ−ジ |
-
1987
- 1987-08-14 JP JP12451187U patent/JPS6429839U/ja active Pending
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS53112061A (en) * | 1977-03-11 | 1978-09-30 | Sharp Corp | Wiring substrate of semiconductor chip |
| JPS58134449A (ja) * | 1982-02-04 | 1983-08-10 | Sharp Corp | Ｌｓｉパツケ−ジ |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH07231194A (ja) * | 1994-02-18 | 1995-08-29 | Nec Commun Syst Ltd | Ｅｍｉ対策処理用ラジエータ |
| WO2001008220A1 (fr) * | 1999-07-28 | 2001-02-01 | Hitachi, Ltd. | Dispositif semi-conducteur |