JPS6427291A - Thin-film electronic device - Google Patents

Thin-film electronic device

Info

Publication number
JPS6427291A
JPS6427291A JP5517887A JP5517887A JPS6427291A JP S6427291 A JPS6427291 A JP S6427291A JP 5517887 A JP5517887 A JP 5517887A JP 5517887 A JP5517887 A JP 5517887A JP S6427291 A JPS6427291 A JP S6427291A
Authority
JP
Japan
Prior art keywords
less
metallic core
enamel substrate
substrate
diameter
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP5517887A
Other languages
Japanese (ja)
Inventor
Hirotaka Yamamoto
Kazumasa Shiraishi
Noriyoshi Shiyouji
Takeaki Kiso
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
TDK Corp
Original Assignee
TDK Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by TDK Corp filed Critical TDK Corp
Priority to JP5517887A priority Critical patent/JPS6427291A/en
Publication of JPS6427291A publication Critical patent/JPS6427291A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/05—Insulated conductive substrates, e.g. insulated metal substrate

Abstract

PURPOSE:To prepare an enamel substrate having desirable surface flatness and to produce a high-quality thin film electronic device with the enamel substrate, by coating a metallic core with porous glass containing voids of a diameter of 2mum or less to provide the enamel substrate, and forming an electronic circuit thereon with thin film elements. CONSTITUTION:A coating of an enamel substrate must contain therein voids with a maximum diameter of 2mum or less. In order to obtain such substrate, glass frit powder having a mean particle diameter of 1mum or less and 80% or more of which has a diameter of 6mum or less is slurried, and a metallic core 1 is dipped in the slurry so that the glass frit is closely adhered on the surface thereof by electrophoresis or the like. The metallic core thus coated is baked at a temperature lower than the resistive temperature of the material of the metallic core 1, so that the glass frit particles in the resulting coating can form a composition fusion bonded with each other or to the surface of the metal with their particle diameter substantially unchanged in comparison with those before the baking. The enamel substrate is allowed to have fine voids occupying less volume therein and therefor the grade of integration as an integrated circuit thereof can be improved.
JP5517887A 1986-05-02 1987-03-12 Thin-film electronic device Pending JPS6427291A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP5517887A JPS6427291A (en) 1986-05-02 1987-03-12 Thin-film electronic device

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP10260086 1986-05-02
JP5517887A JPS6427291A (en) 1986-05-02 1987-03-12 Thin-film electronic device

Publications (1)

Publication Number Publication Date
JPS6427291A true JPS6427291A (en) 1989-01-30

Family

ID=26396046

Family Applications (1)

Application Number Title Priority Date Filing Date
JP5517887A Pending JPS6427291A (en) 1986-05-02 1987-03-12 Thin-film electronic device

Country Status (1)

Country Link
JP (1) JPS6427291A (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0336049A (en) * 1989-07-04 1991-02-15 Matsushita Electric Ind Co Ltd Thermal head and its manufacture
WO2006132150A1 (en) * 2005-06-07 2006-12-14 Fujikura Ltd. Substrate for light-emitting device mounting and light-emitting device module
WO2006132147A1 (en) * 2005-06-07 2006-12-14 Fujikura Ltd. Porcelain enameled substrate for light-emitting device mounting, method for producing same, light-emitting device module, illuminating device, display and traffic signal device

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0336049A (en) * 1989-07-04 1991-02-15 Matsushita Electric Ind Co Ltd Thermal head and its manufacture
WO2006132150A1 (en) * 2005-06-07 2006-12-14 Fujikura Ltd. Substrate for light-emitting device mounting and light-emitting device module
WO2006132147A1 (en) * 2005-06-07 2006-12-14 Fujikura Ltd. Porcelain enameled substrate for light-emitting device mounting, method for producing same, light-emitting device module, illuminating device, display and traffic signal device
US8382345B2 (en) 2005-06-07 2013-02-26 Fujikara Ltd. Porcelain enamel substrate for mounting light emitting device and method of manufacturing the same, light emitting device module, illumination device, display unit and traffic signal

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